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In SMT Assembly, Even One Second of Cycle Time Can Affect Profitability
Folks, Patty had just returned from SMTAI 2015. It was a sentimental meeting with the retirement of longtime executive administrator JoAnn Stromberg. At one of the technical sessions, Patty was
エポキシフラックス再加工手順とクリーンアップ
アンダーフィルや他の競合エポキシフラックスと比較した場合の、756-72のようなインジウム・コーポレーションのエポキシフラックスのもう一つの利点は、当社のエポキシフラックスがリワーク可能であることである。
Preheaters Part X – Selecting the Optimum Preheating System
With the exception of the automated system mentioned in my last post, there is little difference in the actual performance of the various forms of preheaters. The choice is based on convenience and
Epoxy Flux Dispensing and/or Jetting
The dipping process is convenient for the application of epoxy flux because most pick-and-place equipment already has dipping units installed. So, there is no need for extra equipment or the costs
Preheaters Part IX – Automation and Control
As discussed previously, the temperature of the preheater has little comparison with the actual temperature of the PCB. By implementing a dual preheater system, where there is an infrared heat sensor
エポキシフラックス浸漬プロセスの最適化
ディッピング・プロセスによるエポキシ・フラックスの塗布は、従来のPoPフラックスによるディッピング・プロセスと似ているが、部品バンプのフラックス被覆率は異なる。
Preheaters Part VIII – Heating, Wavelength and Infrared
As I mentioned in my previous post, the goal of preheating, regardless of method used, is to increase the metallic structure of the joint to a specified
Voiding in the Thermal Ground Pad of BTC Components
Phil Zarrow: With the advent of bottom terminating components, one of the nemesis of the electronic assembler is voiding in the thermal ground pad of the BTC component. Derrick Herron:
Achieving Uniform Solder Bondline Control Between Substrate and Baseplate in IGBT Assembly: Part II
The next few posts come to us from my colleagues Karthik Vijay, Indium Corporation’s Technical Manager for Europe, and Liam Mills of TT Electronics Power and Hybrid. They’ve done some
ガリウムメンデレーエフの最初の周期表を作るには発見が遅すぎた
Folks, it has been a while. Let’s look in on Patty…. Patty stared at her new Apple® Watch and was pleased. What was most pleasing is that she didn’t expect to be pleased. She heard many
IGBTにおける基板とベースプレート間のはんだ接合線均一性制御の実現:第1部
The next few posts come to us from my colleagues Karthik Vijay, Indium Corporation’s Technical Manager for Europe and Liam Mills of TT Electronics Power and Hybrid. They’ve done some
Estimating the Per Cent Gold In An Alloy: “Wet Gold Technique” Only Works with One Alloying Element… and You Must Know What That Element Is
Folks, The Wet Gold Technique is a simple way to estimate the percentage of gold in a gold alloy. This technique indirectly measures the density of the alloy. From the density of the alloy one can
グラフェン:フラット・パネル・ディスプレイのITOに代わる可能性の低い候補
皆さん、パティが留守の間にロブの様子をお伝えしましょう......ロブはパティに手を振って別れを告げ、1週間の会議に出席するため空港へと車を走らせた。パティは教授、ロブは大学院生になった。
Preheating Part VII – Lamp-Type Infrared and Ceramic Plate
Lamp style preheaters have the fastest response time of any of the previous preheaters mentioned in other posts. The lamp filament is practically the sole thermal mass; it is so fast that the
プレヒーター その6 石英管
As a follow up to my post on quartz plate preheaters for wave soldering, this post isdedicated to the very similar quartz tube preheater. If you remember, one of the advantages of using a quartz
Preheating Part V – Quartz Plate
We continue our discussion of solder reflow methods. As the name suggests, quartz plate preheaters have thick quartz plates in which the heating elements are embedded via pockets or slots. The
Preheating Part IV – Hot Air
My last post talked about the pros and cons of CalRod® style preheaters. This post will be devoted to hot air style preheaters. It makes sense that this was, most likely, the first form of
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インジウムでは、今日、明日、そして未来の課題に対する高度なエレクトロニクス組立材料のソリューションを研究、開発、製造しています。

