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Thermal Management: Why Indium is the Best Choice
In our first review of our Heat-Spring® metal thermal interface material product line, we noted that the Heat-Spring® sprang from customer need. Polymers and greases were not good enough for
80Au/20Sn – solder or braze? Excellent question.
You may have heard the 80% gold 20% tin alloy referred to as a solder. Or, you may have heard it called a braze. I’m going to explain how both statements are correct. As we all know, solders
BGA Voiding in Electronics Assembly
Patty had to admit that the last few weeks were exciting. Her talk to US Army Rangers and Navy Seals on critical thinking went really well. Now, the local newspaper was asking her to comment on
Voiding: A Critical Issue in Electronics Assembly
Folks, Looks like Patty and the teamhave a new assignment from Mike Madigan. Let's look in….. Patty had just waved to her twin boys as they got on the school bus when her mobile phone rang.
AVOID THE VOID®: Large Ground Plane Voiding in Electronics Assembly: Stencil Design
In a previous post I spoke about Large Ground Plane Voiding in Electronics Assembly and referred to a statistical tool called an Ishikawa Diagram. This tool helps map out a process and provides an
EVITARE IL VUOTO®: Vuoto del piano di massa di grandi dimensioni nell'assemblaggio di componenti elettronici: Finitura superficiale del PWB
In a previous post I spoke about Large Ground Plane Voiding in Electronics Assembly and referred to a statistical tool called an Ishikawa Diagram. This tool helps map out a process and provides an
AVOID THE VOID®: Large Ground Plane Voiding in Electronics Assembly: Environment
In un post precedente ho parlato del fenomeno del “Large Ground Plane Voiding” nell’assemblaggio elettronico e ho fatto riferimento a uno strumento statistico chiamato “diagramma di Ishikawa”. Questo strumento aiuta a mappare un processo e fornisce un
How rare is indium — and are we running out?
You've seen this in the news before: We are running out of resources. Oil (a perennial favorite), indium (for many years now), or (as of November 2014), chocolate. Name your resource and you can
Thermal Management Using Indium Metal: The Heat-Spring®
Indium metal has long been used for a variety of applications including low-temperature solder, cryogenic sealing, coatings for touch screens, and in fusible alloys. Most recently it has found its
In SMT Statistical Process Control, Cpk is King
Let’s look in on Patty and the team…… Several weeks ago… It was just before Christmas and Patty was heading in to Ivy U from her home in Woodstock, VT. Just as she passed
EVITARE IL VUOTO®: Vuoto del piano di massa di grandi dimensioni nell'assemblaggio di componenti elettronici: Diagramma di Ishikawa
Avete riscontrato difetti di saldatura? Avete bisogno di aiuto per il vostro processo di assemblaggio elettronico SMT? C'è uno strumento che fa al caso vostro. Gli strumenti statistici, come il Diagramma di Ishikawa, aiutano a tracciare una mappa del processo e a fornire un'idea di
Metal Loading in Solder Paste – A Review (Part 1)
As mentioned in an earlier blog post , a solder paste's alloy type, powder particle size distribution (PSD), and metal loading (weight of metal as a percent or "%w/w") affect the
Conclusion of In Electronics Manufacturing, Does Cpk =1 Yield 66,800 defects per million?
Patty, Rob, and Pete were quite sure they understood the confusion in the Cpk = 1 issue, but wanted to make sure they discussed it with the Professor. After a brief chat with him, they called ACME
Materials Lifetimes – A Modest Proposal
Traveling in Malaysia recently, I met up with an old friend (and customer). We got talking about “lifetime” of solder paste: how long could the material survive various process steps
Nella produzione di elettronica, Cpk =1 produce 66.800 difetti per milione?
Gente, mentre Patty passava davanti all'ufficio del professore per andare a trovare Pete e Rob, ha deciso di fare un salto. "Professore, ho ricevuto una telefonata stranissima... un uomo diceva di avere
Wave Soldering: The Soldering Station – An Introduction
For those of you reading my blog for the first time, you will see that my main focus is on Wave Soldering. I recently completed a series on “preheating” where I talked about the different
Use the Coffin-Manson Equation to Calculate Number of Thermal Cycles
Folks, Let's look in on Patty and friends…. Patty, Rob, and Pete were headed to their regular monthly meeting where they, along with the Professor, discussed a book they were all reading.
In SMT Assembly, Even One Second of Cycle Time Can Affect Profitability
Folks, Patty had just returned from SMTAI 2015. It was a sentimental meeting with the retirement of longtime executive administrator JoAnn Stromberg. At one of the technical sessions, Patty was
Procedura di rilavorazione e pulizia del flusso epossidico
Un altro vantaggio del flussante epossidico di Indium Corporation, come il 756-72, rispetto ai flussanti per sottofondi e ad altre opzioni di flussante epossidico della concorrenza è che il nostro flussante epossidico è rilavorabile.La procedura di rilavorazione
Preheaters Part X – Selecting the Optimum Preheating System
With the exception of the automated system mentioned in my last post, there is little difference in the actual performance of the various forms of preheaters. The choice is based on convenience and
Erogazione e/o spruzzatura di flussante epossidico
The dipping process is convenient for the application of epoxy flux because most pick-and-place equipment already has dipping units installed. So, there is no need for extra equipment or the costs
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In Indium ricerchiamo, sviluppiamo e produciamo materiali avanzati per l'assemblaggio dell'elettronica, in grado di rispondere alle sfide di oggi, di domani e del futuro.

