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In SMT Assembly, Even One Second of Cycle Time Can Affect Profitability
Folks, Patty had just returned from SMTAI 2015. It was a sentimental meeting with the retirement of longtime executive administrator JoAnn Stromberg. At one of the technical sessions, Patty was
Preheaters Part X – Selecting the Optimum Preheating System
With the exception of the automated system mentioned in my last post, there is little difference in the actual performance of the various forms of preheaters. The choice is based on convenience and
Epoxy Flux Dispensing and/or Jetting
The dipping process is convenient for the application of epoxy flux because most pick-and-place equipment already has dipping units installed. So, there is no need for extra equipment or the costs
Preheaters Part IX – Automation and Control
As discussed previously, the temperature of the preheater has little comparison with the actual temperature of the PCB. By implementing a dual preheater system, where there is an infrared heat sensor
Preheaters Part VIII – Heating, Wavelength and Infrared
As I mentioned in my previous post, the goal of preheating, regardless of method used, is to increase the metallic structure of the joint to a specified
Voiding in the Thermal Ground Pad of BTC Components
Phil Zarrow: With the advent of bottom terminating components, one of the nemesis of the electronic assembler is voiding in the thermal ground pad of the BTC component. Derrick Herron:
Achieving Uniform Solder Bondline Control Between Substrate and Baseplate in IGBT Assembly: Part II
The next few posts come to us from my colleagues Karthik Vijay, Indium Corporation’s Technical Manager for Europe, and Liam Mills of TT Electronics Power and Hybrid. They’ve done some
鎵:發現得太遲,無法列入門捷列夫的第一個週期表
Folks, it has been a while. Let’s look in on Patty…. Patty stared at her new Apple® Watch and was pleased. What was most pleasing is that she didn’t expect to be pleased. She heard many
Achieving Uniform Solder Bondline Control Between Substrate and Baseplate in IGBTs: Part I
The next few posts come to us from my colleagues Karthik Vijay, Indium Corporation’s Technical Manager for Europe and Liam Mills of TT Electronics Power and Hybrid. They’ve done some
Estimating the Per Cent Gold In An Alloy: “Wet Gold Technique” Only Works with One Alloying Element… and You Must Know What That Element Is
Folks, The Wet Gold Technique is a simple way to estimate the percentage of gold in a gold alloy. This technique indirectly measures the density of the alloy. From the density of the alloy one can
石墨烯:取代平板顯示器中 ITO 的不可能候選者
各位,讓我們來看看 Rob,而 Patty 則離開了......,當 Patty 駕車前往機場參加一個為期一周的會議時,Rob 向她揮手道別。現在她是一位教授,而他是一位研究生。
Preheating Part VII – Lamp-Type Infrared and Ceramic Plate
Lamp style preheaters have the fastest response time of any of the previous preheaters mentioned in other posts. The lamp filament is practically the sole thermal mass; it is so fast that the
Preheaters Part VI – Quartz Tube
As a follow up to my post on quartz plate preheaters for wave soldering, this post isdedicated to the very similar quartz tube preheater. If you remember, one of the advantages of using a quartz
Preheating Part V – Quartz Plate
We continue our discussion of solder reflow methods. As the name suggests, quartz plate preheaters have thick quartz plates in which the heating elements are embedded via pockets or slots. The
Preheating Part IV – Hot Air
My last post talked about the pros and cons of CalRod® style preheaters. This post will be devoted to hot air style preheaters. It makes sense that this was, most likely, the first form of
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