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Thermal Management: Why Indium is the Best Choice

In our first review of our Heat-Spring® metal thermal interface material product line, we noted that the Heat-Spring® sprang from customer need. Polymers and greases were not good enough for

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80Au/20Sn - souder ou braser ? Excellente question.

You may have heard the 80% gold 20% tin alloy referred to as a solder. Or, you may have heard it called a braze. I’m going to explain how both statements are correct. As we all know, solders

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BGA Voiding in Electronics Assembly

Patty had to admit that the last few weeks were exciting. Her talk to US Army Rangers and Navy Seals on critical thinking went really well. Now, the local newspaper was asking her to comment on

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Voiding: A Critical Issue in Electronics Assembly

Folks, Looks like Patty and the teamhave a new assignment from Mike Madigan. Let's look in….. Patty had just waved to her twin boys as they got on the school bus when her mobile phone rang.

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ÉVITER LE VIDE® : Le grand vide du plan de masse dans l'assemblage électronique : Conception de pochoirs

In a previous post I spoke about Large Ground Plane Voiding in Electronics Assembly and referred to a statistical tool called an Ishikawa Diagram. This tool helps map out a process and provides an

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AVOID THE VOID®: Large Ground Plane Voiding in Electronics Assembly: PWB Surface Finish

In a previous post I spoke about Large Ground Plane Voiding in Electronics Assembly and referred to a statistical tool called an Ishikawa Diagram. This tool helps map out a process and provides an

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AVOID THE VOID®: Large Ground Plane Voiding in Electronics Assembly: Environment

In a previous post I spoke about Large Ground Plane Voiding in Electronics Assembly and referred to a statistical tool called an Ishikawa Diagram. This tool helps map out a process and provide an

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Quelle est la rareté de l'indium et sommes-nous en train d'en manquer ?

You've seen this in the news before: We are running out of resources. Oil (a perennial favorite), indium (for many years now), or (as of November 2014), chocolate. Name your resource and you can

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Thermal Management Using Indium Metal: The Heat-Spring®

Indium metal has long been used for a variety of applications including low-temperature solder, cryogenic sealing, coatings for touch screens, and in fusible alloys. Most recently it has found its

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Dans le contrôle statistique des processus SMT, le Cpk est roi

Let’s look in on Patty and the team…… Several weeks ago… It was just before Christmas and Patty was heading in to Ivy U from her home in Woodstock, VT. Just as she passed

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ÉVITER LE VIDE® : Les grands vides du plan de masse dans l'assemblage électronique : Diagramme d'Ishikawa

Vous rencontrez des défauts de soudure ? Vous avez besoin d'aide pour votre processus d'assemblage électronique SMT ? Il existe un outil pour cela. Les outils statistiques, tels que le diagramme d'Ishikawa, permettent de schématiser un processus et de fournir un aperçu de son évolution.

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Metal Loading in Solder Paste – A Review (Part 1)

As mentioned in an earlier blog post , a solder paste's alloy type, powder particle size distribution (PSD), and metal loading (weight of metal as a percent or "%w/w") affect the

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Conclusion of In Electronics Manufacturing, Does Cpk =1 Yield 66,800 defects per million?

Patty, Rob, and Pete were quite sure they understood the confusion in the Cpk = 1 issue, but wanted to make sure they discussed it with the Professor. After a brief chat with him, they called ACME

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Materials Lifetimes – A Modest Proposal

Traveling in Malaysia recently, I met up with an old friend (and customer). We got talking about “lifetime” of solder paste: how long could the material survive various process steps

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Dans la fabrication de produits électroniques, est-ce que Cpk =1 permet d'obtenir 66 800 défauts par million ?

Alors que Patty passait devant le bureau du professeur en allant voir Pete et Rob, elle a décidé d'y faire un saut. "Professeur, j'ai reçu un appel téléphonique des plus étranges... un homme a prétendu qu'il avait

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Wave Soldering: The Soldering Station – An Introduction

For those of you reading my blog for the first time, you will see that my main focus is on Wave Soldering. I recently completed a series on “preheating” where I talked about the different

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Utiliser l'équation de Coffin-Manson pour calculer le nombre de cycles thermiques

Folks, Let's look in on Patty and friends…. Patty, Rob, and Pete were headed to their regular monthly meeting where they, along with the Professor, discussed a book they were all reading.

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In SMT Assembly, Even One Second of Cycle Time Can Affect Profitability

Folks, Patty had just returned from SMTAI 2015. It was a sentimental meeting with the retirement of longtime executive administrator JoAnn Stromberg. At one of the technical sessions, Patty was

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Procédure de reprise du flux d'époxy et nettoyage

Un autre avantage du flux époxy d'Indium Corporation, tel que le 756-72, par rapport à l'underfill et à d'autres options de flux époxy concurrentes, est que notre flux époxy est retravaillable.

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Préchauffeurs Partie X - Sélection du système de préchauffage optimal

With the exception of the automated system mentioned in my last post, there is little difference in the actual performance of the various forms of preheaters. The choice is based on convenience and

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Distribution et/ou projection de flux époxy

The dipping process is convenient for the application of epoxy flux because most pick-and-place equipment already has dipping units installed. So, there is no need for extra equipment or the costs

Chez Indium, nous recherchons, développons et fabriquons des matériaux d'assemblage électroniques avancés pour répondre aux défis d'aujourd'hui, de demain et de l'avenir.