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在表面贴装技术 ,即使周期时间缩短一秒,也会影响盈利能力
Folks, Patty had just returned from SMTAI 2015. It was a sentimental meeting with the retirement of longtime executive administrator JoAnn Stromberg. At one of the technical sessions, Patty was
Epoxy Flux Rework Procedure and Clean-up
Another advantage of Indium Corporation's epoxy flux, such as the 756-72, compared to underfill and other competitive epoxy flux options is that our epoxy flux is reworkable.The rework procedure
Preheaters Part X – Selecting the Optimum Preheating System
With the exception of the automated system mentioned in my last post, there is little difference in the actual performance of the various forms of preheaters. The choice is based on convenience and
Epoxy Flux Dispensing and/or Jetting
The dipping process is convenient for the application of epoxy flux because most pick-and-place equipment already has dipping units installed. So, there is no need for extra equipment or the costs
Preheaters Part IX – Automation and Control
As discussed previously, the temperature of the preheater has little comparison with the actual temperature of the PCB. By implementing a dual preheater system, where there is an infrared heat sensor
Optimizing the Epoxy Flux Dipping Process
Applying Epoxy flux using a dipping process is similar to the dipping process with conventional PoP flux, with the exception of the flux coverage of the component bump.With conventional PoP flux or
Preheaters Part VIII – Heating, Wavelength and Infrared
As I mentioned in my previous post, the goal of preheating, regardless of method used, is to increase the metallic structure of the joint to a specified
Why Epoxy Flux
Due to the recent increase in interest regarding Epoxy Flux, there are a number of general questions that many people have had about the this unique enabling technology.I decided to sit down with the
Voiding in the Thermal Ground Pad of BTC Components
Phil Zarrow: With the advent of bottom terminating components, one of the nemesis of the electronic assembler is voiding in the thermal ground pad of the BTC component. Derrick Herron:
Achieving Uniform Solder Bondline Control Between Substrate and Baseplate in IGBT Assembly: Part II
The next few posts come to us from my colleagues Karthik Vijay, Indium Corporation’s Technical Manager for Europe, and Liam Mills of TT Electronics Power and Hybrid. They’ve done some
镓(Ga):发现得太晚,未能列入门捷列夫的第一张元素周期表
大家好,好久不见。让我们来看看帕蒂的情况……帕蒂盯着她的新款Apple® Watch,心里很满意。最让她高兴的是,她原本根本没料到自己会这么满意。她听过很多……
Achieving Uniform Solder Bondline Control Between Substrate and Baseplate in IGBTs: Part I
The next few posts come to us from my colleagues Karthik Vijay, Indium Corporation’s Technical Manager for Europe and Liam Mills of TT Electronics Power and Hybrid. They’ve done some
Estimating the Per Cent Gold In An Alloy: “Wet Gold Technique” Only Works with One Alloying Element… and You Must Know What That Element Is
Folks, The Wet Gold Technique is a simple way to estimate the percentage of gold in a gold alloy. This technique indirectly measures the density of the alloy. From the density of the alloy one can
石墨烯:取代平板显示器中 ITO 的不二之选
伙计们,让我们来看看罗布的情况,帕蒂正在离开......,当帕蒂开车去机场参加为期一周的会议时,罗布向她挥手告别。现在,她是一名教授,而他是一名研究生
Preheating Part VII – Lamp-Type Infrared and Ceramic Plate
Lamp style preheaters have the fastest response time of any of the previous preheaters mentioned in other posts. The lamp filament is practically the sole thermal mass; it is so fast that the
预热器第六部分 - 石英管
As a follow up to my post on quartz plate preheaters for wave soldering, this post isdedicated to the very similar quartz tube preheater. If you remember, one of the advantages of using a quartz
Preheating Part V – Quartz Plate
We continue our discussion of solder reflow methods. As the name suggests, quartz plate preheaters have thick quartz plates in which the heating elements are embedded via pockets or slots. The
Preheating Part IV – Hot Air
My last post talked about the pros and cons of CalRod® style preheaters. This post will be devoted to hot air style preheaters. It makes sense that this was, most likely, the first form of
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