Posted On: September 6th, 2017 | By: Indium Corporation®

SMTA International 2017: Warpage-Induced Defects & Component Warpage Limits Panel Discussion

Brook Sandy-Smith will chair a panel on Warpage-Induced Defects & Component Warpage Limits at SMTAI 2017 ...

Posted On: October 12th, 2016 | By: Indium Corporation®

Achieving 8% Voiding When Soldering Bottom-Terminated Components (VIDEO)

A paper presented at SMTAI 2016 on reducing voids in bottom-terminated components......

Posted On: April 8th, 2016 | By: Phil Zarrow & Dr. Ron Lasky

Minimizing the Head-in-Pillow Defect in SMT Assembly

This video is for those in the SMT electronics assembly industry that want to minimize the head-in-pillow defect. It discusses the solder paste proper...

Posted On: February 4th, 2016 | By: Eric Bastow

In Soldering, Understanding the Cause and Cure for NWO (Non-Wet Opens)

Non-Wet Opens (NWO): Understand the cause as well as the necessary flux technology to mitigate them....

Posted On: January 17th, 2016 | By: Dr. Ron Lasky

In SMT Statistical Process Control, Cpk is King

In SMT Statistical Process Control, the bottom line is that Cpk is king. Here's the proof....

Posted On: August 24th, 2015 | By: Dr. Ron Lasky

Handbook of Electronic Assembly Now Available

Folks, It is hard to imagine, but it has been just a little short of 13 years ago that Jim Hall, Phil Zarrow and I approached SMTA’s JoAnn Strom...

Posted On: May 15th, 2015 | By: Adam Murling

Jumping into JMP- ANOVA Analysis

My most recent blog topics have had to do with Wave Soldering Machine Components, but statistics is also something that interests me. Have y...

Posted On: April 13th, 2015 | By: Jim Hisert

Reflow Profiling, Electrical Reliability, No-Clean Solder Paste Flux Residues

It sounds bad for me to say this, but I have a lot of SMT magazines cross my desk and, honestly, the solder paste articles rarely draw my interest. I ...