Indium Corporation’s, Dr. HongWen Zhang, Manager, R&D Alloy Group, will present at China Semiconductor Packaging Test Seminar (CSPT) 2018 from Nov. 19-21 in Hefei, Anhui, China.
It is well known that lead-containing materials can have harmful effects on human health and the environment. Furthermore, emerging high power semiconductor devices and modules serving high current and high junction temperatures of 150°C or higher require more reliable materials with high thermal conductivity. Considering these two challenges, Indium Corporation has started the exploration into high-temperature lead-free materials to help promote and support the industry’s progress toward lead-free.
Dr. Zhang’s presentation, Lead-Free Bonding Materials for Power Semiconductor Die-Attachment, examines die-attach material alternatives for these emerging, high-power semiconductor devices. Balancing materials’ reliability and cost, Zhang outlines potential alternatives, including solder and diffusion bonding materials.
Dr. Zhang joined Indium Corporation in 2008 as a Research Metallurgist responsible for the development of new high-temperature lead-free solders. He and Dr. Ning-Cheng Lee invented the mixed powder solder technique, which was the basis for developing the BiAgX® solder system. He has published more than 20 papers and journal articles. He received his PhD in material science and engineering, as well as a master’s degree in mechanical engineering from Michigan Technological University. Dr. Zhang holds a Lean Six Sigma Green Belt and is IPC-A-600 and IPC-A-610D trained.
During the show, Indium Corporation will feature those products referenced during Dr. Zhang’s presentation, BiAgX® and NC-SMQ®75, at its booth, as well as other advanced materials for semiconductor packaging.
Die Indium Corporation ist ein führender Materialhersteller und -lieferant für die weltweiten Märkte für Elektronik, Halbleiter, Dünnschichten und Wärmemanagement. Zu den Produkten gehören Lote und Flussmittel, Hartlote, Materialien für thermische Schnittstellen, Sputtertargets, Metalle und anorganische Verbindungen aus Indium, Gallium, Germanium und Zinn sowie NanoFoil®. Das 1934 gegründete Unternehmen verfügt über einen weltweiten technischen Support und Fabriken in China, Malaysia, Singapur, Südkorea, dem Vereinigten Königreich und den USA.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
