Indium Corporation’s Kenneth Thum, Senior Technical Support Engineer, will present at IEEE EPTC Singapore 2019, December 4-6, in Singapore.
The development of heterogeneous integration, which packs more dies or components into smaller footprints, requires multiple technological advancements in various aspects of advanced packaging. Thum will present Soldering Material Evolution for Heterogeneous Integration, which outlines trends in soldering material technology for heterogeneous integration, including solder paste, and flip-chip and ball-attach fluxes.
Thum assists customers in Northern Malaysia and Thailand by troubleshooting issues and providing technical support for Indium Corporation’s full product range. He has over 10 years of experience in PCBA assembly and IC packaging. Thum earned his bachelor’s degree from the University of Malaya in computer aided design and computer aided manufacturing. Additionally, he is a Certified SMT Process Engineer.
To view additional papers authored by Indium Corporation’s experts, visit indiumstg.wpenginepowered.com/techlibrary.
Die Indium Corporation ist ein führender Materialhersteller und -lieferant für die weltweiten Märkte der Elektronik-, Halbleiter-, Dünnschicht- und Wärmemanagementindustrie. Zu den Produkten gehören Lote und Flussmittel, Hartlote, Materialien für thermische Schnittstellen, Sputtertargets, Metalle und anorganische Verbindungen aus Indium, Gallium, Germanium und Zinn sowie NanoFoil®. Das 1934 gegründete Unternehmen verfügt über einen weltweiten technischen Support und Fabriken in China, Indien, Malaysia, Singapur, Südkorea, dem Vereinigten Königreich und den USA.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another®(#FOETA), at www.facebook.com/indium or @IndiumCorp.
