Indium Corporation’s Kenneth Thum, Senior Technical Support Engineer, will present at IEEE EPTC Singapore 2019, December 4-6, in Singapore.
The development of heterogeneous integration, which packs more dies or components into smaller footprints, requires multiple technological advancements in various aspects of advanced packaging. Thum will present Soldering Material Evolution for Heterogeneous Integration, which outlines trends in soldering material technology for heterogeneous integration, including solder paste, and flip-chip and ball-attach fluxes.
Thum assists customers in Northern Malaysia and Thailand by troubleshooting issues and providing technical support for Indium Corporation’s full product range. He has over 10 years of experience in PCBA assembly and IC packaging. Thum earned his bachelor’s degree from the University of Malaya in computer aided design and computer aided manufacturing. Additionally, he is a Certified SMT Process Engineer.
To view additional papers authored by Indium Corporation’s experts, visit indiumstg.wpenginepowered.com/techlibrary.
铟泰公司 面向全球电子、半导体、薄膜及热管理 顶级材料制造商和供应商。产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡的金属及化合物；以及NanoFoil®。公司成立于1934年，拥有全球技术支持网络，并在中国、印度、马来西亚、新加坡、韩国、英国和美国设有工厂。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another®(#FOETA), at www.facebook.com/indium or @IndiumCorp.
