Indium Corporation announces that Glen Thomas has been named Product Manager for PCB Assembly Solder Paste.
Thomas is responsible for managing the company’s entire line of solder paste materials for PCB assembly. He will work closely with the sales, technical support, research and development, manufacturing, and quality teams to ensure the product line best meets the needs of the customers.
Thomas has over 25 years of experience working with printed wiring boards and semiconductor packaging. He has held marketing and applications engineering roles at several companies, including Endicott Interconnect Technology, Kyocera, and IBM. He has also traveled extensively throughout Asia and lived in Japan for two years.
Thomas earned his bachelor’s degree in chemical engineering from the University of Wisconsin and his master’s degree, also in chemical engineering, from Michigan State University.
Die Indium Corporation ist ein führender Materialhersteller und -lieferant für die weltweiten Elektronik-, Halbleiter-, Solar-, Dünnschicht- und Wärmemanagementmärkte. Zu den Produkten gehören Lote und Flussmittel, Hartlote, Materialien für thermische Schnittstellen, Sputtertargets, Metalle und anorganische Verbindungen aus Indium, Gallium, Germanium und Zinn sowie NanoFoil®. Indium wurde 1934 gegründet und verfügt über einen weltweiten technischen Support und Fabriken in China, Singapur, Südkorea, Großbritannien und den USA.
Weitere Informationen über die Indium Corporation erhalten Sie unter www.indium.com oder per E-Mail an [email protected].
