Indium Corporation announces that Glen Thomas has been named Product Manager for PCB Assembly Solder Paste.
Thomas is responsible for managing the company’s entire line of solder paste materials for PCB assembly. He will work closely with the sales, technical support, research and development, manufacturing, and quality teams to ensure the product line best meets the needs of the customers.
Thomas has over 25 years of experience working with printed wiring boards and semiconductor packaging. He has held marketing and applications engineering roles at several companies, including Endicott Interconnect Technology, Kyocera, and IBM. He has also traveled extensively throughout Asia and lived in Japan for two years.
Thomas earned his bachelor’s degree in chemical engineering from the University of Wisconsin and his master’s degree, also in chemical engineering, from Michigan State University.
Indium Corporation 是全球電子、半導體、太陽能、薄膜及熱管理市場的首屈一指的材料製造商與供應商。 產品涵蓋焊料與助焊劑、釬料、熱界面材料、濺鍍靶材、銦、鎵、鍺及錫等金屬與無機化合物，以及 NanoFoil®。銦公司成立於 1934 年，擁有全球技術支援體系，並在中國、新加坡、南韓、英國及美國設有工廠。
如需進一步了解 Indium Corporation，請造訪indiumstg.wpenginepowered.com或發送電子郵件至[email protected]。
