Indium Corporation will feature Indium11.8HF-SPR Solder Paste a new air and nitrogen reflow, no-clean, Pb-free solder paste designed to meet the fine feature printing requirements of mobile manufacturers at IPC APEX Expo 2018, Feb. 24-March 1 in San Diego, Calif.
Indium11.8HF-SPR specifically addresses customers needs for Type 5 powder. This new solder paste delivers unprecedented stencil print transfer efficiency on the broadest range of processes, while maintaining industry-leading reflow performance.
Vorteile von Indium11.8HF-SPR:
- Halogenfrei nach IEC 61249-2-21 Prüfverfahren EN14582
- High-transfer efficiency through small apertures
( 0.66AR) - Lange Lebensdauer der Schablone (>12 Stunden)
- Eliminiert Heiß- und Kaltverformung, um Brückenbildung und Lötperlenbildung zu verhindern
- Vermeidet das Potenzial für HIP und Graping-Defekte durch eine einzigartige Oxidationsbarriere
To learn more about Indium11.8HF-SPR, visit Indium Corporation at the show at booth #1625.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another (#FOETA), at www.facebook.com/indium or @IndiumCorp.
