Pressemitteilungen

Indium Corporations Leo Hu, senior area technical manager – East China, will present on fine feature solder paste printing for SiP at SiP Conference China, May 21, Shanghai,

Indium Corporation’s Global Product Manager, Semiconductor and Advanced Materials, Sze Pei Lim, will present a paper on low-temperature first level interconnects during the virtual ICEP, May

Indium Corporation, a global electronics materials refiner, smelter, manufacturer, and supplier, announced today that Solder Chemistry, a German producer of soldering technology, is now part of the

Indium Corporation’s Dr. Ron Lasky, Senior Technologist, has created a new SMT IQ Test for new or veteran industry professionals looking for a fun way to measure their surface mount technology

At Indium Corporation, we believe that materials science changes the world. In recognition of the notable material behind our name, we will release monthly installments of the Elements of Indium

Indium Corporation’s Andy Mackie, PhD, MSc, Principal Engineer and Manager, Thermal Interface Materials Applications, will host a Webex webinar focused on the thermal management market in

Three of Indium Corporation’s experts will share their industry knowledge and insight during SMTA China East Technology Conference, April 21-22 in Shanghai, China. This event is held in

Indium Corporation has earned the Circuits Assembly New Product Introduction (NPI) Award for its new flux-cored wire for robotic and laser soldering. The award was presented on Tuesday,

Three Indium Corporation experts will share their industry knowledge during the 17th Annual Device Packaging Conference (DPC 2021) organized by IMAPS, from April 12-15. The high-performance computing

Indium Corporation earned Electronics Manufacturing (EM) World's Innovation Award for its new flux-cored wire for robotic and laser soldering. The award was presented on Thursday, March

Indium Corporation’s Claire Hotvedt, CSMPTE, Product Development Specialist, will host a Webex webinar focused on its innovative low-temperature solder offering as part of Indium

Indium Corporations Joe Hertline, Product Manager ESM/Power Electronics, will present on power electronics for electric vehicles during the CHARGED EV Engineering Virtual Conference on Wednesday,

Indium Corporation is offering newly-hired applicants a $500 sign-on bonus as it aims to fill 50 production operator positions at its facilities in Utica, Rome, and Clinton. These positions are

Indium Corporation will feature the award-winning Durafuse™ LT–the novel, low-temperature alloy system designed to provide high-reliability in low-temperature

Indium Corporation will feature its uniquely formulated flux-cored wire during the virtual IPC APEX Expo, to be held March 8-12. Indium Corporation’s CW-232 is a highly activated

Indium Corporation’s newest jetting solder paste, PicoShot® NC-5M, has received official approval from Mycronic as a qualified jetting solder paste. PicoShot® NC-5M and its associated

Indium Corporation’s Meagan Sloan, CSMTPE, Technical Support Engineer, will host an InSIDER Series webinar on stencil printing fundamentals in two sessions on Tuesday, March 2 at Noon Eastern

Indium Corporation will feature its innovative high-reliability, low-temperature alloy system during the virtual IPC APEX Expo, to be held March 8-12. Durafuse™ LT is a novel,

Indium Corporation’s Product Development Specialist Miloš Lazi will share his industry knowledge on thermal interface materials (TIMs) at the virtual IPC APEX Expo, to be held March