プレスリリース

Indium Corporations Dr. HongWen Zhang, R&D Manager, Alloy Group, will host webinar on the ongoing evolution of lead-free solder alloys via WebEx on Tuesday, Jan. 19 at 10 a.m. Eastern

Indium Corporation’s Dr. HongWen Zhang, R&D Manager, Alloy Group, will share his industry expertise during the IEEE Electronics Packaging Society (EPS) Malaysia Chapter Webinar Series

Indium Corporation’s newest jetting and microdispensing solder paste, Indium12.8HF, has been officially recommended by NSW Automation for use with their newest microfluid dispenser,

Indium Corporation’s Joe Hertline, Product Manager – ESM/Power Electronics, will present during a live technical webinar on power electronics for IMAPS on Wednesday, Dec. 9

Indium Corporation’s Adam Murling, Technical Support Engineer, will participate in a virtual miniaturization roundtable hosted by BarTron on Thursday, Dec. 10 at 10 a.m.

Indium Corporation’s Chris Nash, Product Manager, PCB Assembly Solder Paste, will participate in a Global SMT & Packaging debate on low-temperature solders on Tuesday,

Indium Corporation and Valuetronics International have formed a strategic partnership to serve customers in the Americas with its cored wire, rework fluxes, and bar solder products.

Indium Corporation earned BISinfotech’s BETA Award for Global Innovative Solder Paste Solutions Provider of the Year on Friday, October 30 during a virtual

Indium Corporation’s Tim Jensen, Senior Product Manager for Engineered Solder Materials, will present during IMAPS-UK/IEEE-EPS’s online thermal management conference from Nov.

Indium Corporation and RENEX Group have formed a strategic partnership for the service of their PCB and engineered solder materials in

Indium Corporation’s Jonas Sjoberg, Associate Director for Global Technical Service & Application Engineering, participated in a soldering-focused webinar hosted

Indium Corporation earned the Mexico Technology Award for its patent-pending Durafuse™ LT low-temperature alloy system. The Mexico Technology Awards, sponsored by Mexico

Indium Corporation earned Electronics Maker’s Best of Industry Award for ‘Excellence in Electronics Assembly Materials’ on Thursday, October 15 during a virtual ceremony.

Indium Corporation will feature its suite of ultra-low residue flip-chip fluxes for enabling the 5G lifestyle at the 18th China Semiconductor Packaging and Test Seminar (CSPT),

Indium Corporation’s Leo Hu, Area Technical Manager, will present at the China Semiconductor Packaging Test (CSPT) Technology & Marketing Conference, November 8-10, TianShui City, China.

Indium Corporation offers high-purity indium metal as a quality starting material for all indium-based compound semiconductor substrates. Indium Corporation’s high-purity indium

Indium Corporation’s Sze Pei Lim, Regional Product Manager, will host an InSIDER Series webinar on soldering material technology for heterogeneous integration on Webex at 8:30 a.m.

Indium Corporation’s Andreas Karch, Regional Technical Manager for Germany, Austria, and Switzerland, will present at the virtual EPP InnovationsFORUM Germany on Oct. 28 at

Indium Corporation’s Anson Yu, Technical Manager for Global Accounts in Asia, will present at the LEAP Expo, November 3-5 in Shenzhen, China. Low-temperature soldering is not a

Indium Corporation’s Claire Hotvedt, Product Development Specialist, has been honored by the Genesis Group’s 15th Annual Striving for Success Program. The program

Indium Corporation has released a new high-reliability alloy with enhanced thermal cycling performance specially formulated for harsh environments. Indalloy®292 is an innovative