Pressemitteilungen

Indium Corporation announces the promotion of Ed Briggs to Senior Technical Support Engineer. Briggs provides technical support to customers in Eastern Canada and the Southeastern United States and

Indium Corporation will feature its new technology platform using the SACm™ Solder Alloy at Surface Mount Technology Association International (SMTAi) October 15-17 in Fort Worth, Texas.

Indium Corporations Liyakathali Koorithodi, Senior Technical Support Engineer, will present at the launch of a new SMTA chapter in Bangalore, India on September 25. Liyakathalis presentation,

Indium Corporation announces a new technology platform using the SACm™ solder alloy that satisfies the continuing demand for cost-effective reliability requirements of portable electronic

Indium Corporations Dr. Ning-Cheng Lee, Vice President of Technology, will give a technology workshop at the SMTA South China Conference August 26 in Shenzhen, China.

Indium Corporation will feature its new SACm™ Soldering Alloy at Nepcon South China August 27-29 in Shenzhen, China. SACm™ is a high-reliability, low-cost soldering alloy that offers drop

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Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, will give two presentations and teach a professional development course at the International Conference on Electronic

Indium Corporation and Duksan Hi-Metal Co., Ltd. announce a formal agreement to facilitate the global supply of an advanced alloy technology used to manufacture solder balls (spheres) for

Indium Corporation announces that Sean DeZalia has joined Indium Corporation as a chemical engineer. DeZalia will focus on performing and documenting laboratory experiments. His responsibilities

Indium Corporation’s Liyakathali Koorithodi, Senior Technical Support Engineer, will present at IPC APEX India Wednesday, August 28 in Bangalore,

Indium Corporation’s Greg Evans, President and CEO, was presented with the Alumni of Merit Award by Mohawk Valley Community College. Evans earned his associate degree in engineering science

Indium Corporation’s Mario Scalzo, Senior Technical Support Engineer, will present at the Surface Mount Technology Association’s Ohio Valley Expo and Tech Forum, July 11 in Independence,

Indium Corporation's new SACm™ is a high-reliability solder alloy that offers drop shock performance far superior to other SAC alloys, without compromising on thermal cycling – all at

Indium Corporation’s Indium8.9HFA Solder Paste is a versatile, halogen-free, Pb-free, solder paste with leading print performance on miniaturized components. Assemblers and OEMs are adopting

Indium Corporations Tim Jensen, Product Manager PCB Assembly Materials, will present a two-part webtorial, titled Top Pb-Free PCB Assembly Defects: Cause and Cure, as part of a webtorial series

Indium Corporation’s Ed Briggs, Technical Support Engineer, Southeast USA and Eastern Canada, will participate in the Solder Joint Failure Analysis session at the Surface Mount Technology

Indium Corporations Dr. Ning-Cheng Lee, Vice President of Technology, will present at IPCs Innovations in Electronics Manufacturing for Medical Devices conference Wednesday, June 12 in Minneapolis,

Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, will give several presentations at the 63rd Electronic Components and Technology Conference (ECTC) May 28-31 in Las Vegas,

Indium Corporation’s Brook Sandy-Smith, Product Support Specialist – PCB Assembly Materials, will present at the International Microelectronics and Packaging Society (IMAPS) Advanced

Indium Corporations Brook Sandy-Smith, Product Specialist PCB Assembly Materials, will present at the inaugural Electronic System Technologies Conference May 20-23 in Las Vegas, Nev. Sandy-Smith will