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Indium Corporation is celebrating National Manufacturing Day, October 4, 2013, with a variety of activities intended to promote STEM (science, technology, engineering, and math) education and career

Indium Corporation introduces a full line of soldering products that satisfy IPCs J-STD004B. The IPCs new 004B has stricter requirements for measuring halogens and electromigration risk. Indium

Indium Corporation’s Dr. HongWen Zhang, Research Metallurgist, will present at the 2013 Electronics Packaging Symposium October 15-16 at Binghamton University in Binghamton, New York. Dr.

Several Indium Corporation technology experts will present at the Surface Mount Technology Association’s International Conference and Exhibition (SMTAi) on October 15-17 in Fort Worth, Texas.

Indium Corporation’s Tim Jensen, Product Manager – PCB Assembly Materials, will give a tutorial at SMTA International (SMTAi) on October 14, in Fort Worth,

Indium Corporation will feature high-reliability gold-based solders at the International Symposium on Microelectronics (IMAPS) September 30 – October 3 in Orlando, Florida. Gold-based solders

Indium Corporation’s Dr. Robert Ploessl, Manager of Market and Technology Assessment and Product Manager for Compounds, will present at the Minor Metals Americas Conference, September 26-27 in

Indium Corporation’s Brook Sandy-Smith, Product Support Specialist – PCB Assembly Materials, will present at the Business Electronic Soldering Technologies (BEST) 2013 Tech Symposium on

Indium Corporation technology experts will present at the 46th International Symposium on Micro Electronics September 30-October 3 in Orlando, Florida. Dr. Ning-Cheng Lee, Vice President of

Indium Corporation will feature its new technology platform using the SACm™ Solder Alloy at Productronica November 12-15 in Münich, Germany. SACm™ is a high-reliability solder alloy

Indium Corporations Liyakathali Koorithodi, Senior Technical Support Engineer, will present at the launch of a new SMTA chapter in Bangalore, India on September 25. Liyakathalis presentation,

The Surface Mount Technology Association (SMTA)s Intermountain Chapter will hold its annual technical symposium on September 19 at the University of Utah in the Warnock Engineering Building, Salt

Indium Corporation announces the promotion of Ed Briggs to Senior Technical Support Engineer. Briggs provides technical support to customers in Eastern Canada and the Southeastern United States and

Indium Corporation will feature its new technology platform using the SACm™ Solder Alloy at Surface Mount Technology Association International (SMTAi) October 15-17 in Fort Worth, Texas.

Indium Corporations Liyakathali Koorithodi, Senior Technical Support Engineer, will present at the launch of a new SMTA chapter in Bangalore, India on September 25. Liyakathalis presentation,

Indium Corporation announces a new technology platform using the SACm™ solder alloy that satisfies the continuing demand for cost-effective reliability requirements of portable electronic

Indium Corporations Dr. Ning-Cheng Lee, Vice President of Technology, will give a technology workshop at the SMTA South China Conference August 26 in Shenzhen, China.

Indium Corporation will feature its new SACm™ Soldering Alloy at Nepcon South China August 27-29 in Shenzhen, China. SACm™ is a high-reliability, low-cost soldering alloy that offers drop

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Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, will give two presentations and teach a professional development course at the International Conference on Electronic

Indium Corporation and Duksan Hi-Metal Co., Ltd. announce a formal agreement to facilitate the global supply of an advanced alloy technology used to manufacture solder balls (spheres) for