Indium Corporation's Dr. Ning-Cheng Lee, Vice President of Technology, will present at the Electronic Components and Technology Conference (ECTC) May 26-29 in San Diego, Calif.
Dr. Lee's presentation, Achieving Low-Porosity Sintering of Nano-Ag Paste via a Pressureless Process, reviews the use of a newly-developed nano-Ag paste that allows for a pressureless sintered die-attach process. This process creates sintered joints that exhibit very low porosity, high joint shear strength, and very good electrical and thermal conductivity.
Dr. Lee is a world-renowned soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests include advanced materials for interconnects and packaging for electronics and optoelectronics applications, with an emphasis on both high performance and low cost of ownership.
ECTC is a premier international event that brings together the best in packaging, component, and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the Components, Packaging, and Manufacturing Technology (CPMT) Society of the IEEE.
Indium Corporation es uno de los principales fabricantes y proveedores de materiales para los mercados mundiales de la electrónica, los semiconductores, la energía solar, la capa fina y la gestión térmica. Sus productos incluyen soldaduras y fundentes; soldaduras fuertes; materiales de interfaz térmica; cátodos para sputtering; metales y compuestos inorgánicos de indio, galio, germanio y estaño; y NanoFoil®. Fundada en 1934, Indium cuenta con asistencia técnica mundial y fábricas en China, Malasia, Singapur, Corea del Sur, Reino Unido y Estados Unidos.
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