Indium Corporation's Dr. Ning-Cheng Lee, Vice President of Technology, will present at the Electronic Components and Technology Conference (ECTC) May 26-29 in San Diego, Calif.
Dr. Lee's presentation, Achieving Low-Porosity Sintering of Nano-Ag Paste via a Pressureless Process, reviews the use of a newly-developed nano-Ag paste that allows for a pressureless sintered die-attach process. This process creates sintered joints that exhibit very low porosity, high joint shear strength, and very good electrical and thermal conductivity.
Dr. Lee is a world-renowned soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests include advanced materials for interconnects and packaging for electronics and optoelectronics applications, with an emphasis on both high performance and low cost of ownership.
ECTC is a premier international event that brings together the best in packaging, component, and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the Components, Packaging, and Manufacturing Technology (CPMT) Society of the IEEE.
インジウム・コーポレーションは、世界のエレクトロニクス、半導体、太陽電池、薄膜、熱管理市場に材料を供給する一流メーカーです。製品には、はんだおよびフラックス、ろう材、熱界面材料、スパッタリングターゲット、インジウム、ガリウム、ゲルマニウム、スズの金属および無機化合物、NanoFoil®などがあります。1934年に設立されたインジウムは、グローバルな技術サポートと中国、マレーシア、シンガポール、韓国、英国、米国に工場を有しています。
インジウム・コーポレーションに関する詳細については、indiumstg.wpenginepowered.comをご覧いただくか、[email protected] までメールでお問い合わせください。また、当社の専門家による「From One Engineer ToAnother®（#FOETA）」を、www.facebook.com/indiumまたは@IndiumCorp でフォローすることもできます。
