Indium Corporation will feature its LV1000 flux-coated solder preforms for 5G infrastructure at the 52nd International Symposium on Electronics (IMAPS) Boston, September 30–October 3, in Boston, Massachusetts.
Indium Corporation’s LV1000 answers the demands of 5G wireless infrastructure by delivering superior reliability and performance. LV1000 produces lower voiding as compared to conventional solders, especially for bottom termination components (BTCs), which do not allow for proper outgassing of volatized flux. Its glossy, uniform flux coating eliminates the fluxing step. Combined with its durability, LV1000 can be integrated easily into automated assembly processes.
LV1000 technology consists of both a unique flux formulation and a coating process to produce flux-coated solder preforms that meet the tightest tolerances for flatness. This minimizes defects by ensuring that electronic components solder correctly.
For more information about LV1000, visit indiumstg.wpenginepowered.com/LV1000.
Indium Corporation es uno de los principales fabricantes y proveedores de materiales para los mercados mundiales de la electrónica, los semiconductores, las películas finas y la gestión térmica. Sus productos incluyen soldaduras y fundentes, soldaduras fuertes, materiales de interfaz térmica, cátodos para sputtering, metales y compuestos inorgánicos de indio, galio, germanio y estaño, y NanoFoil®. Fundada en 1934, la empresa cuenta con asistencia técnica mundial y fábricas en China, Malasia, Singapur, Corea del Sur, Reino Unido y Estados Unidos.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
