Indium Corporation will feature its LV1000 flux-coated solder preforms for 5G infrastructure at the 52nd International Symposium on Electronics (IMAPS) Boston, September 30–October 3, in Boston, Massachusetts.
Indium Corporation’s LV1000 answers the demands of 5G wireless infrastructure by delivering superior reliability and performance. LV1000 produces lower voiding as compared to conventional solders, especially for bottom termination components (BTCs), which do not allow for proper outgassing of volatized flux. Its glossy, uniform flux coating eliminates the fluxing step. Combined with its durability, LV1000 can be integrated easily into automated assembly processes.
LV1000 technology consists of both a unique flux formulation and a coating process to produce flux-coated solder preforms that meet the tightest tolerances for flatness. This minimizes defects by ensuring that electronic components solder correctly.
For more information about LV1000, visit indiumstg.wpenginepowered.com/LV1000.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊料和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。公司成立於 1934 年，擁有全球性的技術支援，工廠位於中國、馬來西亞、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
