As part of its electric vehicle (EV) focused series of webinars, Driving e-Mobility: Rel-ion Technical Webinars, Indium Corporation‘s EV experts are excited to announce the second webinar in this series.
The second session in the Driving e-Mobility: Rel-ion Technical Webinar series is scheduled for May 11 with two opportunities to participate: the first at 8:30 a.m. Germany/12 p.m. India/2:30 p.m. China, Malaysia and the second at 10 a.m. San Francisco/1 p.m. New York/6 p.m. London/7 p.m. Germany. This webinar, titled Voiding Mechanisms & Solutions For High Density Automotive Electronics, will feature Principal Engineer Global Accounts Technical Manager Dave Sbiroli.
Since the early days of SMT assembly, one of the most persistent defects with the greatest longevity is voiding in solder joints. Other defectssuch as graping, head-in-pillow, and non-wet openshave known solutions, but voiding remains largely unsolved and with each technology inflection seems to make a strong comeback. The increased use of bottom-terminated components (BTC), high-density electronics, and high-reliability alloys needed for today’s automotive applications has resulted in a renewed focus on voiding reduction. Voiding in solder bumped components (e.g., BGAs and CSPs) and BTCs (including QFNs and DPAK) each have their own unique cause and mitigation techniques. To consistently maintain an acceptable level of voiding per industry standards and self-imposed levels due to stringent in-use requirements, a detailed understanding of the unique causes of voiding and process mitigation techniques is needed. This session will review the cause-and-effect relationship between voiding and the soldering materials used in today’s electronics assemblies. Sbiroli will also review material and process solutions to maintain acceptable levels of voiding in various forms of SMT assembly.
La serie Driving e-Mobility: Rel-ion Technical Webinars cuenta con la participación de expertos técnicos de la industria mundial de materiales avanzados y del mercado de la automoción. Todas las sesiones están moderadas por Brian O'Leary, responsable mundial de movilidad eléctrica e infraestructuras de Indium Corporation. Esta serie de seminarios web está dirigida específicamente a quienes trabajan en el campo de la movilidad eléctrica, tanto si son nuevos en el sector como si cuentan con varios años de experiencia, ya que el sector de los vehículos eléctricos está experimentando un rápido crecimiento y evolución.
Registration for this webinaras well as the rest in this seriesis open and can be completed at indium.com/corporate/media-center/webinars/rel-ion.php. If you are interested in a session specifically tailored to your company’s needs, please contact Brian O’Leary.
Sbiroli has more than 25 years of hands-on experience in the selection and applications of printed circuit board assembly materials and SMT process optimization, defect reduction, and troubleshooting on hundreds of Indium Corporation customers’ SMT and electronic assembly production lines. He achieved one of the highest scores on the SMTA Process Engineer certification exam and is certified as an IPC Specialist for IPC-A-600 and IPC-A-610D. Sbiroli actively participates in the development of industry standards with the IPC and received the IPC’s Distinguished Committee Service award for his work on the J-STD-004B (Requirements for Soldering Fluxes) standards.
O'Leary es responsable de la promoción de toda la gama de productos y servicios de Indium Corporation para la movilidad eléctrica, que incluye coches eléctricos, camiones y estaciones de carga. Cuenta con más de 20 años de experiencia en ventas, marketing y gestión de canales en la industria electrónica.
Las próximas sesiones de la serie Driving e-Mobility: Rel-ion Technical Webinar son las siguientes:
- June 28: Building More Reliable Assemblies for Higher Mission Profiles presented by Technical Manager for Europe, Africa, and the Middle East Karthik Vijay
- Sept. 21: Design Considerations for Board Layout & Material Selection co-presented by Associate Director for Global Technical Service & Application Engineering Jonas Sjoberg and Applications Engineer Design for Excellence Specialist ngelo Marques
- Oct. 12: Best Practices for SMT Assembly & Root Cause Analysis presented by Sbiroli
Acerca de Indium Corporation
Indium Corporation es un importante refinador, fundidor, fabricante y proveedor de materiales para los mercados mundiales de la electrónica, los semiconductores, las películas finas y la gestión térmica. Sus productos incluyen soldaduras y fundentes; soldaduras fuertes; materiales de interfaz térmica; cátodos para sputtering; metales y compuestos inorgánicos de indio, galio, germanio y estaño; y NanoFoil. Fundada en 1934, la empresa cuenta con asistencia técnica mundial y fábricas en China, Alemania, India, Malasia, Singapur, Corea del Sur, Reino Unido y Estados Unidos.
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