Indium Corporation, Utica's Technology Company™, has named Derrick Herron, Christopher Nash, Raymond Luo, and Andy Wei the winners of the 2015 Silver Quill Award.
Indium Corporation's Silver Quill Award program encourages individuals to author world-class technical reports, presentations, articles, and books. It then honors the most effective works based on their relevance to, and impact on, the industry.
Coauthored by Herron, Nash, Luo, and Wei, the technical paper, Voiding Control Beneath BTCs Using Solder Fortification Preforms, discusses one of the biggest challenges facing the electronics assembly industry today – voiding in the solder joints that connect bottom-terminated components to PCBs. This paper explores a new technique that uses Solder Fortification® Preforms for an easy and inexpensive process modification that can decrease both the level of voiding and the amount of variation in this value.
Herron is a Technical Support Engineer for Indium Corporation and provides technical service to customers in the northeastern United States. Previously, he spent more than six years working in Indium Corporation's research and development laboratory, focusing on developments in solder paste and flux technologies. Herron earned his bachelor's degree in chemistry from Oklahoma State University, Stillwater, Okla. He earned his Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth.
Nash, PCBA New Product Development Manager, is responsible for proactively planning, organizing, and implementing Indium Corporation's product development cycle from concept to product launch. His previous experience includes inside sales, product management, and technical support. Nash earned his bachelor's degree from Clarkson University and his Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth. Additionally, he is an SMTA-certified process engineer.
Luo is Indium Corporation's Area Tech Manager, South China. He provides technical support for Indium Corporation's electronics assembly materials, semiconductor and advanced assembly materials, and engineered solders and thermal management materials. He has more than eight years of experience in surface mount technology. Luo earned his bachelor's degree in mechanical and electronics engineering from Guilin University of Electronic Technology in Guilin, Guangxi, China.
Wei is a Senior Technical Support Engineer based in Shenzhen, China. He provides technical support for Indium Corporation's electronics assembly materials, semiconductor and advanced assembly materials, and engineered solders and thermal management materials for customers in southern China. Wei has more than eight years of experience in electronics assembly, providing field support for soldering materials and SMT process applications. He is an SMTA-certified process engineer.
The award-winning paper can be downloaded at indiumstg.wpenginepowered.com/voiding-control-BTC.
Indium Corporation es uno de los principales fabricantes y proveedores de materiales para los mercados mundiales de la electrónica, los semiconductores, la capa fina, la gestión térmica y la energía solar. Sus productos incluyen soldaduras y fundentes; soldaduras fuertes; materiales de interfaz térmica; cátodos para sputtering; metales y compuestos inorgánicos de indio, galio, germanio y estaño; y NanoFoil®. Fundada en 1934, Indium cuenta con asistencia técnica mundial y fábricas en China, Malasia, Singapur, Corea del Sur, Reino Unido y Estados Unidos.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
