Indium Corporation Senior Technical Support Engineer Mario Scalzo will share his expertise at IPC Midwest Conference and Exhibition on August 23, 2012.
Mario’s presentation, The Effect of Powder Surface Area and Oxidation on the Voiding Performance of PoP Solder Pastes, uses data to discuss how the voiding performance of PoP solder pastes could be affected by powder surface area and oxidation. The presentation is based on a paper by the same name, authored by Indium Corporation Technical Support Engineer Brandon Judd. A copy of the paper can be downloaded at www.indium.com/techlibrary/whitepapers.
Mario joined Indium Corporation in 2000. He holds a bachelors degree in chemistry from Saint Anselm College and a certificate from the American Chemical Society for Professional Education. He is an SMTA-Certified Process Engineer and earned his Six Sigma Black Belt from Dartmouth College’s Thayer School of Engineering. Mario is the author of the Electronics Assembly Materials blog, https://www.indium.com/blogs/Mario-Scalzo-Blog/.
IPC is a global trade association dedicated to the competitive excellence and financial success of its member companies that represent all facets of the electronics interconnect industry. IPC is a leading source for industry standards, training, market research, and public policy advocacy.
Indium Corporation es uno de los principales proveedores de materiales para los mercados mundiales de la electrónica, los semiconductores, la energía solar, la capa fina y la gestión térmica. Sus productos incluyen soldaduras, preformas y fundentes; soldaduras fuertes; cátodos para sputter; compuestos de indio, galio, germanio y estaño, y metales de alta pureza; y Reactive NanoFoil®. Fundada en 1934, Indium Corporation cuenta con asistencia técnica mundial y fábricas en China, Singapur, Corea del Sur, Reino Unido y Estados Unidos.
Para más información sobre Indium Corporation, visite www.indium.com o envíe un correo electrónico a [email protected].
