Indium Corporation’s Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, will present at the SMTA Empire Expo and Tech Forum on June 15 in Liverpool, NY.
Sandy-Smith, an internationally recognized speaker on PCB assembly, will present Investigating Test Methods for Electrochemical Consistency in PCB Assembly Processes. Her presentation will review traditional and emerging methods to characterize flux residues and cleanliness of finished assemblies, including surface insulation resistance (SIR), electrochemical migration, ROSE extraction, and other emerging test methods. She will also share data showing how different methods can detect process variations in multiple ways.
Sandy-Smith is a Technical Support Engineer, specializing in printed circuit board assembly materials, particularly solder paste. She conducts application testing and qualifications for new product introductions. Sandy-Smith earned degrees in chemical engineering (with a focus on materials) and German language from the University of Rhode Island. She previously worked in R&D, developing conductive adhesives for die- and strap-attach, as well as conductive inks for RFID applications. Her areas of expertise include analytical testing of conductive materials, applications such as screen-printing and jet dispensing (jetting), as well as scale-up and pre-production of developmental materials.
Indium Corporation es uno de los principales fabricantes y proveedores de materiales para los mercados mundiales de la electrónica, los semiconductores, las películas finas y la gestión térmica. Sus productos incluyen soldaduras y fundentes; soldaduras fuertes; materiales de interfaz térmica; cátodos para sputtering; metales y compuestos inorgánicos de indio, galio, germanio y estaño; y NanoFoil®. Fundada en 1934, Indium cuenta con asistencia técnica mundial y fábricas en China, Malasia, Singapur, Corea del Sur, Reino Unido y Estados Unidos.
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