Indium Corporation’s Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, will present at the SMTA Empire Expo and Tech Forum on June 15 in Liverpool, NY.
Sandy-Smith, an internationally recognized speaker on PCB assembly, will present Investigating Test Methods for Electrochemical Consistency in PCB Assembly Processes. Her presentation will review traditional and emerging methods to characterize flux residues and cleanliness of finished assemblies, including surface insulation resistance (SIR), electrochemical migration, ROSE extraction, and other emerging test methods. She will also share data showing how different methods can detect process variations in multiple ways.
Sandy-Smith is a Technical Support Engineer, specializing in printed circuit board assembly materials, particularly solder paste. She conducts application testing and qualifications for new product introductions. Sandy-Smith earned degrees in chemical engineering (with a focus on materials) and German language from the University of Rhode Island. She previously worked in R&D, developing conductive adhesives for die- and strap-attach, as well as conductive inks for RFID applications. Her areas of expertise include analytical testing of conductive materials, applications such as screen-printing and jet dispensing (jetting), as well as scale-up and pre-production of developmental materials.
Indium Corporation 是全球电子、半导体、薄膜和热管理市场的主要材料制造商和供应商。产品包括焊料和助焊剂；钎料；热界面材料；溅射靶材；铟、镓、锗、锡金属和无机化合物；以及 NanoFoil®。Indium 公司成立于 1934 年，在中国、马来西亚、新加坡、韩国、英国和美国拥有全球性的技术支持和工厂。
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