Indium Corporation is proud to introduce new, high-reliability Au-based Precision Die-Attach (PDA) Preforms. Compared to standard preforms, these gold-based PDA preforms offer a higher level of precision to reduce defects, control bondline thickness (BLT), and deliver high-yield performance and reliability in critical die-attach applications.
Semiconductor laser die-attach applications require the highest quality, ultra-precise solder preforms to ensure accuracy and repeatability during assembly for a guaranteed, highly reliable end product. Indium Corporations Au-based PDA Preforms offer the new gold standard. Features include:
- Control de espesor de alta precisión
- Calidad precisa de los bordes
- Limpieza optimizada
- Método de empaquetado de gofres por defecto
- Disponible para aleaciones con base de oro
We are excited to offer our gold-based PDA preforms because they are able to uniquely meet our customers needs for highly automated, precision processes, said Indium Corporation Senior Product Manager Jeff Anweiler. They not only reduce solder-related defects and die-tilt, but they also increase process yield performance. These products deliver superior thermal transfer, operational efficiency, and device reliability, especially for critical laser and RF applications, as well as 5G communications.
Indium Corporations Au-based PDA Preforms are available in the following alloys:
- Aleaciones primarias:
- 80Au/20Sn
- 79Au/21Sn
- Aleaciones de desarrollo:
- 78Au/22Sn; 77Au/23Sn; 76Au/24Sn; 75Au/25Sn
- 88Au/12Ge
- 96,8Au/3,2Si
- 82Au/18In
Selecting the right preform characteristics and packaging is crucial for consistent success in production processes. Every application has unique parameters, making it essential to design a preform and its packaging to meet these specific needs. To learn more about Indium Corporations gold-based solder preforms, visit https://www.indium.com/products/solders/gold/gold-preforms/
Acerca de Indium Corporation
Indium Corporation es un importante refinador, fundidor, fabricante y proveedor de materiales para los mercados mundiales de la electrónica, los semiconductores, las películas finas y la gestión térmica. Sus productos incluyen soldaduras y fundentes; soldaduras fuertes; materiales de interfaz térmica; cátodos para sputtering; metales y compuestos inorgánicos de indio, galio, germanio y estaño; y NanoFoil. Fundada en 1934, la empresa cuenta con asistencia técnica mundial y fábricas en China, Alemania, India, Malasia, Singapur, Corea del Sur, Reino Unido y Estados Unidos.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email Jingya Huang. You can also follow our experts, From One Engineer To Another (#FOETA), at www.linkedin.com/company/indium-corporation/.
