Indium Corporation continues to expand its flux portfolio with WS-823a proven, one-step ball grid array (BGA) ball-attach flux designed to eliminate the costly and warpage-inducing prefluxing step, especially on Cu-OSP substrate.
While the standard ball-attach process requires two steps, especially on a Cu-OSP substrate, WS-823 is a halogen-free, water-wash flux designed for a single-step ball-attach process that eliminates the prefluxing step in order to create reliable ball-to-pad joints.
WS-823 provides:
- Tackiness suitable for holding solder spheres in place during reflow
- Excellent solderability on a wide range of surfaces, including AuNi and oxidized Cu-OSP
- Uniform pin transfer over extended periods, eliminating changes in joint quality over time and uneven deposit sizes, which can lead to “missing ball”
- A formula engineered for low-voiding, thereby increasing joint strength
- Good cleanability with room temperature DI water, avoiding the formation of white residue
For more information on WS-823, and other materials in Indium Corporation’s ball-attach flux porfolio, visit www.indium.com/ball-attach.
Acerca de Indium Corporation
Indium Corporation es un importante refinador, fundidor, fabricante y proveedor de materiales para los mercados mundiales de la electrónica, los semiconductores, las películas finas y la gestión térmica. Sus productos incluyen soldaduras y fundentes, soldaduras fuertes, materiales de interfaz térmica, cátodos para sputtering, metales y compuestos inorgánicos de indio, galio, germanio y estaño, y NanoFoil. Fundada en 1934, la empresa cuenta con asistencia técnica mundial y fábricas en China, Alemania, India, Malasia, Singapur, Corea del Sur, Reino Unido y Estados Unidos.
For more information about Indium Corporation, visit www.indium.com or contact Jingya Huang. You can also follow our experts, From One Engineer To Another (#FOETA), at www.linkedin.com/company/indium-corporation/ or @IndiumCorp.
