Indium Corporation continues to expand its flux portfolio with WS-823a proven, one-step ball grid array (BGA) ball-attach flux designed to eliminate the costly and warpage-inducing prefluxing step, especially on Cu-OSP substrate.
While the standard ball-attach process requires two steps, especially on a Cu-OSP substrate, WS-823 is a halogen-free, water-wash flux designed for a single-step ball-attach process that eliminates the prefluxing step in order to create reliable ball-to-pad joints.
WS-823 provides:
- Tackiness suitable for holding solder spheres in place during reflow
- Excellent solderability on a wide range of surfaces, including AuNi and oxidized Cu-OSP
- Uniform pin transfer over extended periods, eliminating changes in joint quality over time and uneven deposit sizes, which can lead to “missing ball”
- A formula engineered for low-voiding, thereby increasing joint strength
- Good cleanability with room temperature DI water, avoiding the formation of white residue
For more information on WS-823, and other materials in Indium Corporation’s ball-attach flux porfolio, visit indiumstg.wpenginepowered.com/ball-attach.
關於 Indium Corporation
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料精煉商、冶煉商、製造商和供應商。產品包括焊料和助熔劑、钎料、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物以及 NanoFoil。公司成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、德國、印度、馬來西亞、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or contact Jingya Huang. You can also follow our experts, From One Engineer To Another (#FOETA), at www.linkedin.com/company/indium-corporation/ or @IndiumCorp.
