球型接頭焊劑

The ball-attach process can be considered a trivial step when creating an FCBGA or similar package, but the final soldering step can be rather complex. There are several variables that impact the

I recently visited a customer to help optimize a flux-less indium soldering application. They admitted they needed flux but didn’t know 1) what to use, or 2) if there was a better way to fix

This is the shape of flux deposits left after pin transfer Spheres attached after pin transfer Pin transfer is a way of selectively depositing a semi-solid or liquid material (like a solder paste or

Package-on-Package solder paste is a relatively new concept in the solder industry. With limited material sets, we need to be able to capitalize on the flexibility of the few solder pastes that are

各位，Patty 在去見 Pete 和 Rob 的路上經過教授的辦公室，她決定順道來看看。"教授，我接到一個奇怪的電話......一個男人聲稱他有

很多不熟悉半導體產品的人都覺得它們很嚇人。我也曾經覺得它們很嚇人，但現在我意識到，半導體磁通量不應該被視為是嚇人的。

當我知道我的團隊的產品線時，我首先要 Google 的詞彙之一是「流變學」，定義為「處理流體流動的物理學分支」。

當然，球接製程並不如其他製程那麼令人興奮，例如倒裝晶片組裝、2.5D 與 3D 製程。

各位，這篇文章是摘錄自 Indium Corporation 的《印刷電路組裝人員焊錫缺陷指南》(The Printed Circuits Assemblers Guide to Solder Defects)中關於繪圖的內容。引言 個人電子設備的成長持續