Indium Corporation will feature its proven solder paste for Heterogeneous Integration & Assembly (HIA) and system-in-package (SiP) applications at Advanced System in Package (SiP) Technology Conference & Exhibition, June 25-27 in Monterey, California.
Indium Corporation’s Indium3.2HF Solder Paste meets current and evolving challenges encountered in fine-pitch Heterogeneous Integration and SiP applications. Indium3.2HF delivers:
- Consistent printing performance
- Long stencil life
- Excelente resistencia al desprendimiento
- Excellent wetting ability
- Capacidad superior de soldadura de paso fino
- Water solubility
Indium Corporation’s soldering materials for HIA and SiP applications have a proven track record of success in more than 2 billon front-end module SiP devices manufactured in the last three years using the company’s materials.
See Indium Corporation’s experts at the show or visit the company’s HIA page at indiumstg.wpenginepowered.com/HIA to learn more.
Indium Corporation es uno de los principales fabricantes y proveedores de materiales para los mercados mundiales de la electrónica, los semiconductores, las películas finas y la gestión térmica. Sus productos incluyen soldaduras y fundentes, soldaduras fuertes, materiales de interfaz térmica, cátodos para sputtering, metales y compuestos inorgánicos de indio, galio, germanio y estaño, y NanoFoil®. Fundada en 1934, la empresa cuenta con asistencia técnica mundial y fábricas en China, Malasia, Singapur, Corea del Sur, Reino Unido y Estados Unidos.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
