Indium Corporation has earned the CIRCUITS ASSEMBLY New Product Introduction (NPI) Award for its low-voiding, Pb-free solder paste, Indium8.9HFRV. The award was presented at the IPC APEX Expo in Anaheim, California, on April 10.
The NPI Awards recognize the leading new products for electronics assembly during the past 12 months. An independent panel of practicing engineers selects honorees.
At Indium Corporation, we believe that materials science changes the world, said Vice President of Sales, Marketing, and Technical Service, Tim Twining. It is a tremendous honor for Indium8.9HFRV, a new innovative product, which reduces voiding and improves the reliability of our customers products, to be recognized with CIRCUITS Assemblys prestigious NPI Award.
A flux vehicle developed from the industry-leading Indium8.9HF chemistry, Indium8.9HFRV is a new air reflow, no-clean solder formulated to improve the voiding performance of next-generation Pb-free high-reliability alloys. Applications requiring extended thermal cycling performance at higher temperatures may require suitable high-reliability alloys. Indium8.9HFRV is a superior choice for high-reliability alloys, providing both voiding mitigation performance and excellent electrical and process reliability. The flux is also fully compatible with the standard SnAgCu alloy systems favored by the electronics industry for other applications.
Among its key features, Indium8.9HFRV offers:
- Faible miction
- Efficacité de transfert élevée à travers de petites ouvertures (0,66AR)
- Excellente mouillabilité
- Outstanding response-to-pause performance
- Compatibility with both Air and N2 reflow environments
For more information about Indium Corporations no-clean, Pb-free solder pastes, visit https://www.indium.com/products/solders/solder-paste/lead-free/no-clean/.
À propos d'Indium Corporation
Indium Corporation est un raffineur, un fondeur, un fabricant et un fournisseur de matériaux de premier plan pour les marchés mondiaux de l'électronique, des semi-conducteurs, des couches minces et de la gestion thermique. Ses produits comprennent des soudures et des flux, des brasures, des matériaux d'interface thermique, des cibles de pulvérisation, des métaux et des composés inorganiques d'indium, de gallium, de germanium et d'étain, ainsi que des feuilles NanoFoil. Fondée en 1934, l'entreprise dispose d'une assistance technique mondiale et d'usines situées en Chine, en Allemagne, en Inde, en Malaisie, à Singapour, en Corée du Sud, au Royaume-Uni et aux États-Unis.
Pour plus d'informations sur Indium Corporation, visitez le site www.indium.com ou envoyez un courriel à Jingya Huang. Vous pouvez également suivre nos experts, From One Engineer To Another (#FOETA), à l'adresse www.linkedin.com/company/indium-corporation/.
