Indium Corporation has earned the CIRCUITS ASSEMBLY New Product Introduction (NPI) Award for its low-voiding, Pb-free solder paste, Indium8.9HFRV. The award was presented at the IPC APEX Expo in Anaheim, California, on April 10.
The NPI Awards recognize the leading new products for electronics assembly during the past 12 months. An independent panel of practicing engineers selects honorees.
At Indium Corporation, we believe that materials science changes the world, said Vice President of Sales, Marketing, and Technical Service, Tim Twining. It is a tremendous honor for Indium8.9HFRV, a new innovative product, which reduces voiding and improves the reliability of our customers products, to be recognized with CIRCUITS Assemblys prestigious NPI Award.
A flux vehicle developed from the industry-leading Indium8.9HF chemistry, Indium8.9HFRV is a new air reflow, no-clean solder formulated to improve the voiding performance of next-generation Pb-free high-reliability alloys. Applications requiring extended thermal cycling performance at higher temperatures may require suitable high-reliability alloys. Indium8.9HFRV is a superior choice for high-reliability alloys, providing both voiding mitigation performance and excellent electrical and process reliability. The flux is also fully compatible with the standard SnAgCu alloy systems favored by the electronics industry for other applications.
Among its key features, Indium8.9HFRV offers:
- Low voiding
- High transfer efficiency through small apertures (0.66AR)
- Excellent wetting
- Outstanding response-to-pause performance
- Compatibility with both Air and N2 reflow environments
For more information about Indium Corporations no-clean, Pb-free solder pastes, visit https://www.indium.com/products/solders/solder-paste/lead-free/no-clean/.
Acerca de Indium Corporation
Indium Corporation es un importante refinador, fundidor, fabricante y proveedor de materiales para los mercados mundiales de la electrónica, los semiconductores, las películas finas y la gestión térmica. Sus productos incluyen soldaduras y fundentes; soldaduras fuertes; materiales de interfaz térmica; cátodos para sputtering; metales y compuestos inorgánicos de indio, galio, germanio y estaño; y NanoFoil. Fundada en 1934, la empresa cuenta con asistencia técnica mundial y fábricas en China, Alemania, India, Malasia, Singapur, Corea del Sur, Reino Unido y Estados Unidos.
Para más información sobre Indium Corporation, visite www.indium.com o envíe un correo electrónico a Jingya Huang. También puede seguir a nuestros expertos, From One Engineer To Another (#FOETA), en www.linkedin.com/company/indium-corporation/.
