Indium Corporation® is set to introduce its newest Heat-Spring® pattern—HSx. Designed for large area dies with warpage challenges and pressure limitations, HSx will be introduced at TestConX 2025, taking place March 3-5 in Mesa, Arizona.
As a global leader in high-performance metal thermal interface materials (TIMs), Indium Corporation will showcase the following selections from its array of high-performance metal TIM solutions:
Heat-Spring® HSx (New)
- Newest pattern designed for large area dies with warpage >200 microns
- Effective thermal conductivity of 16W/m-K at only 20psi with pure indium
- Designed for test heads where clamping forces are limited to <30psi
- Thickness ranging from 300 micron up to 1mm
- Available with or without a diffusion barrier to prevent staining of the die
Heat-Spring® HSD
- The original and best standard option for interfaces with flat, smooth, and parallel surfaces
- Progettato per interfacce con stretto controllo della superficie >30psi
Heat-Spring® High Profile Preforms
- Modellato per ottimizzare il contatto con le superfici non piane, con una resa di 86W/mK.
- Ideal for assemblies with an extruded, unfinished heat-sink
- Recommended for immersion cooling and burn-in applications
- Fornisce un contatto uniforme tra la testa di burn-in e il DUT
- Fornisce una conducibilità termica più uniforme
Heat-Spring® HSK
- Consigliato specificamente per le applicazioni di burn-in in cui sono necessari più inserimenti
- Fornisce un contatto uniforme con una bassa resistenza per carichi termici ad alta densità
- Tipicamente rivestito con una sottile barriera di diffusione, che funge da superficie di contatto per le applicazioni di burn-in e di test.
- Nessuna macchia o crepa
All Heat-Spring® products are recyclable and reclaimable.
To learn more about Indium Corporation’s metal TIMs for burn-in and test, visit our experts at booth #45 at TestConX, or online at https://www.indium.com/products/thermal-interface-materials/.
About Indium Corporation
Indium Corporation® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.
For more information about Indium Corporation, visit www.indium.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/.
