StratEdge 以其前瞻性的設計使用了我多年來一直推薦的材料來密封他們的半導體封裝，我很驚訝地看到在 2008 年夏季版的《熱能新聞》中，StratEdge 的熱能增強封裝設計得到了強調。(按此閱讀完整文章）。
我見過半導體封裝產生極高的熱量，以至於環氧樹脂甚至是傳統的焊封都無法在不影響封裝可靠性的情況下承受這些熱量。金基焊料合金是一個例外，它可以承受高達 360C 的溫度，並且具有極佳的熱傳導特性。
如果您有興趣評估這些材料或有相關問題，請隨時與我聯絡！
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