Indium Corporation is proud to introduce a novel alloy technology that enables lower processing temperatures in preform soldering, at Productronica 2023, November 14-17, in Munich, Germany. Specifically developed for power module package-attach applications, Indalloy301-LT is a bismuth-free alloy that prevents thermal defects in the module without sacrificing reliability like traditional bismuth-containing, low-temperature alloys.
Available in InFORMS configurations, Indalloy301-LT offers a solution for consistent bondline thickness and improved strength to enhance thermal and mechanical reliability of the solder joint while reducing processing temperature and energy input during manufacturing. This enables complementary Pb-free high-reliability alloy technologies such as Indalloy276 to be used in power module die-attach, component-attach, or interconnects without the risk of re-melt and degraded performance. Indalloy301-LT is also available in preforms and ribbon configurations and can be offered flux-free or with Indium Corporation’s flux coating technology.
“With increasing mission profile demands in power electronics applications, such as EV power module-cooler integration, preform soldering offers superior thermal and mechanical performance compared to traditional thermal interface materials,” said Product Manager Joe Hertline. “By leveraging this new alloy technology in package-attach applications, designers can prevent warpage, encapsulation breakdown and delamination issues by reducing processing temperature, making preform soldering a viable approach with robust thermal and mechanical reliability performance.”
Indalloy301-LT features:
- Reduced reflow peak temperatures by 50C compared to commonly used alloys in power electronics assembly
- Prevention of warpage and delamination in molded power module package-attach
- Ability to step-solder with Pb-free alloys
- Excellent thermal and electrical conductivity
- Solid reliability performance (TST -40C125C)
- Reduced energy consumption
- Available in preforms, ribbon, and InFORMS
For more information about Indium Corporation’s high-reliability alloy products, visit www.indium.com/products/solders/solder-alloys/ or contact Joe Hertline.
關於 Indium Corporation
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料精煉商、冶煉商、製造商和供應商。產品包括焊料和助熔劑；銅钎；熱介面材料；濺鍍靶材；铟、鎵、锗、錫金屬和無機化合物；以及 NanoFoil 。公司成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、德國、印度、馬來西亞、新加坡、南韓、英國和美國。
如需更多關於 Indium Corporation 的資訊，請造訪www.indium.com或寄電子郵件給Jingya Huang。您也可以在www.linkedin.com/company/indium-corporation/ 追蹤我們的專家，From One Engineer To Another (#FOETA)。
