Indium Corporation‘s Principal Engineer Advanced Materials Andy C. Mackie, Ph.D., MSc, is scheduled to present on day one of the 2024 Critical Materials Council (CMC) Conference taking place April 10-11 in Chandler, AZ, U.S. The two-day event provides actionable information, on materials and supply-chains, for current and future semiconductor manufacturing.
Dr. Mackie’s presentation, titled From SiP to SiC: Advanced Metal Alloys Meet Evolving Reliability Challenges, will examine the continuing importance of metals in advanced digital and power packaging for both electrical and thermal electronics assembly.
“Engineered alloys for assembly materials, along with novel and emerging assembly processes, are enabling the future of electronics assembly and packaging,” said Dr. Mackie. “I look forward to exploring this timely topic with my industry colleagues at CMC.”
Dr. Mackie focuses on identifying the intersection of novel materials, emerging technologies, and their potential business impact. His professional experience covers all aspects of materials and processes for electronics manufacturing from wafer fabrication to semiconductor assembly and packaging and SMT/electronics assembly. Dr. Mackie holds a Ph.D. in physical chemistry from the University of Nottingham, UK, and a Master of Science (MSc) in physical chemistry and surface science from the University of Bristol, UK.
關於 Indium Corporation
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料精煉商、冶煉商、製造商和供應商。產品包括焊料和助熔劑；銅钎；熱介面材料；濺鍍靶材；铟、鎵、锗、錫金屬和無機化合物；以及 NanoFoil 。公司成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、德國、印度、馬來西亞、新加坡、南韓、英國和美國。
如需更多關於 Indium Corporation 的資訊，請造訪www.indium.com或寄電子郵件給Jingya Huang。您也可以在www.linkedin.com/company/indium-corporation/ 追蹤我們的專家，From One Engineer To Another (#FOETA)。
