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Indium Corporation to Host Webinar on LED Device Assembly

Indium Corporation‘s Evan Griffith, Product Specialist for Semiconductor and Advanced Assembly Materials, will host two webinars about the increasing complexity of LED device assembly as part of the company’s free InSIDER Series. The webinars, focusing on the same topic area, will premier on July 18 at 9 a.m. ET and July 19 at 9 p.m. ET. 

Particularly in the advanced assembly space, there has been renewed interested in smaller LED technologies that support advanced display devices and other lighting technologies. This webinar will focus on two of those technologies, MiniLED and MicroLED. Griffith will first explain the differences in application between these two technologies and how the market has necessitated the development of each. He will then analyze the typical assembly process flow of building both MiniLED and MicroLED devices and the differences between those assemblies and that of standard SMT assembly. Lastly, Griffith will examine the design of soldering material for MiniLED and MicroLED assembly and relevant material properties and test methods for ensuring high-yield devices.

“As LED devices become more complex, so does the soldering assembly of the materials involved,” said Griffith. “From infotainment screens in modern vehicles to large video walls at sports stadiums and even modern televsions, advanced LED technology is responsible for the advancements enabling these devices. From a solder manufacturer’s perspective, the assembly of these advanced LED technologies is paramount to understand in order to meet the needs of this advancing market.” 

To register or learn about these upcoming sessions, visit indium.com/webinars. The webinar links will be shared with registrants the day of the event. Registrants must use a company email account to avoid Indium Corporation’s spam filters. This is a first-come, first-served event.

Griffith is a product specialist for SEMI/SAAM fluxes and SiPaste materials. He is based at Indium Corporation’s global headquarters. He is responsible for researching and analyzing customer and market data, and facilitating current and prospective customers’ needs. Additionally, he supports customers’ inquiries, internal product trainings, and works closely with Indium Corporation’s R&D team on new applications. He earned his Bachelor of Engineering degree in Materials Science, graduating with honors, and his Master of Engineering Management degree from the Thayer School of Engineering at Dartmouth College, Hanover, N.H., U.S. He has also earned his Six Sigma Green Belt.

關於 Indium Corporation

Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料精煉商、冶煉商、製造商和供應商。產品包括焊料和助熔劑;銅钎;熱介面材料;濺鍍靶材;铟、鎵、锗、錫金屬和無機化合物;以及 NanoFoil 。公司成立於 1934 年,擁有全球性的技術支援,工廠分佈於中國、德國、印度、馬來西亞、新加坡、南韓、英國和美國。

如需更多關於 Indium Corporation 的資訊,請造訪www.indium.com或寄電子郵件給Jingya Huang。您也可以透過www.linkedin.com/company/indium-corporation/@IndiumCorp 追蹤我們的專家,From One Engineer To Another (#FOETA)。