Indium Corporation announces a new solder paste technology. BiAgX® is a high-melting lead-free (Pb-free) solder paste technology designed for high reliability electronics assembly applications. Designed as a drop-in replacement for standard high Pb-containing solder pastes, it has passed MSL1 and thermal cycle testing at several power semiconductor customers.
BiAgX® is excellent for small, low-voltage QFN packages that are used in portable electronics (smartphone/tablet), automotive electronics, and industrial applications. It excels in high temperature environments in excess of 150°C. It requires minimal process adjustments and no capital expenditures for customers converting from a standard high Pb-containing solder paste-based process.
BiAgX® addresses both customer demands and potential legislative changes that eliminate lead from high-melting die-attach applications. It is both Pb-free and Sb-free (lead and antimony) and does not contain costly specialty materials, such as nanosilver or sintering aids.
BiAgX® reflows, solders, wets, and solidifies just like any other solder paste, and is available in both dispense and printing forms. Fluxes are cleanable with standard cleaning chemistries and processes.
For more information about BiAgX®, including technical papers and other technical information, visit indiumstg.wpenginepowered.com/BiAgX.
Die Indium Corporation ist ein führender Materialhersteller und -lieferant für die weltweiten Elektronik-, Halbleiter-, Solar-, Dünnschicht- und Wärmemanagementmärkte. Zu den Produkten gehören Lote, Vorformlinge und Flussmittel, Hartlote, Sputtertargets, Indium-, Gallium- und Germaniummetalle und anorganische Verbindungen sowie NanoFoil®. Indium wurde 1934 gegründet und verfügt über einen weltweiten technischen Support und Fabriken in China, Singapur, Südkorea, Großbritannien und den USA.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
