Indium Corporation’s Joey Qiao, Area Technical Manager for Eastern China, will share his technical expertise at the IPC Electronics Assembly High Reliability Technical Conference on August 18 in Ningbo, China. The conference focuses on reliability for both automotive and communications electronics.
Qiao’s presentation, Low Temperature Solders: New Applications and Challenges, covers:
- Drivers for low-temperature soldering
- Forecast on solder melting temperatures for SMT assembly
- Low-temperature alloy applications, test results, and recommendations
Qiao is an Area Technical Manager for Eastern China. He joined Indium Corporation in 2015 and has more than 12 years of experience in the electronics industry. Qiao provides technical support for Indium Corporation’s electronics assembly materials, engineered solders, and thermal management materials for customers in Eastern China. Qiao holds a Six Sigma Green Belt and Process Failure Mode Effects Analysis (PFMEA) certification. He is also an ISO-13485 internal auditor.
Die Indium Corporation ist ein führender Materialhersteller und -lieferant für die weltweiten Märkte der Elektronik-, Halbleiter-, Dünnschicht- und Wärmemanagementindustrie. Zu den Produkten gehören Lote und Flussmittel, Hartlote, Materialien für thermische Schnittstellen, Sputtertargets, Metalle und anorganische Verbindungen aus Indium, Gallium, Germanium und Zinn sowie NanoFoil®. Das 1934 gegründete Unternehmen verfügt über einen weltweiten technischen Support und Fabriken in China, Malaysia, Singapur, Südkorea, dem Vereinigten Königreich und den USA.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
