Indium Corporation’s Joey Qiao, Area Technical Manager for Eastern China, will share his technical expertise at the IPC Electronics Assembly High Reliability Technical Conference on August 18 in Ningbo, China. The conference focuses on reliability for both automotive and communications electronics.
Qiao’s presentation, Low Temperature Solders: New Applications and Challenges, covers:
- Drivers for low-temperature soldering
- Forecast on solder melting temperatures for SMT assembly
- Low-temperature alloy applications, test results, and recommendations
Qiao is an Area Technical Manager for Eastern China. He joined Indium Corporation in 2015 and has more than 12 years of experience in the electronics industry. Qiao provides technical support for Indium Corporation’s electronics assembly materials, engineered solders, and thermal management materials for customers in Eastern China. Qiao holds a Six Sigma Green Belt and Process Failure Mode Effects Analysis (PFMEA) certification. He is also an ISO-13485 internal auditor.
Indium Corporation은 전 세계 전자, 반도체, 박막 및 열 관리 시장에 최고의 소재를 제조 및 공급하는 기업입니다. 주요 제품으로는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil® 등이 있습니다. 1934년에 설립된 Indium은 중국, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
