Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, and Seven Liang, Assistant Area Technical Manager – Southern China, presented at two separate events in China on Sept. 18.
Dr. Lee delivered a presentation, Challenges and Solutions for the Assembly of Thin-Profile Devices, at a seminar hosted by Indium Corporation and ZESTRON in Chengdu. His presentation included a discussion regarding the challenges for materials, processes, reliability, and cost of thin-profile devices, as well as Indium Corporation’s development of a new flux and soldering alloy that address these critical challenges.
Liang presented Engineered Solders Instructions and Application Case Study at the IPC Tour event in Shenzhen. Topics covered included engineered solder attributes, performance, processes, and examples.
Dr. Lee is a world-renowned soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests include advanced materials for interconnects, and packaging for electronics and optoelectronics applications, with an emphasis on both high-performance and low cost of ownership.
Liang is based in Shenzhen, China, and provides technical support for Indium Corporation’s electronics assembly materials, semiconductor, engineering solders, and thermal management materials for customers in southern China. Liang has more than ten years of experience in electronics assembly, including providing field support for soldering materials applications.
Die Indium Corporation ist ein führender Materialhersteller und -lieferant für die weltweiten Elektronik-, Halbleiter-, Dünnschicht-, Wärmemanagement- und Solarmärkte. Zu den Produkten gehören Lote und Flussmittel, Hartlote, Materialien für thermische Schnittstellen, Sputtertargets, Metalle und anorganische Verbindungen aus Indium, Gallium, Germanium und Zinn sowie NanoFoil®. Das 1934 gegründete Unternehmen verfügt über einen weltweiten technischen Support und Fabriken in China, Malaysia, Singapur, Südkorea, dem Vereinigten Königreich und den USA.
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