Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, and Seven Liang, Assistant Area Technical Manager – Southern China, presented at two separate events in China on Sept. 18.
Dr. Lee delivered a presentation, Challenges and Solutions for the Assembly of Thin-Profile Devices, at a seminar hosted by Indium Corporation and ZESTRON in Chengdu. His presentation included a discussion regarding the challenges for materials, processes, reliability, and cost of thin-profile devices, as well as Indium Corporation’s development of a new flux and soldering alloy that address these critical challenges.
Liang presented Engineered Solders Instructions and Application Case Study at the IPC Tour event in Shenzhen. Topics covered included engineered solder attributes, performance, processes, and examples.
Dr. Lee is a world-renowned soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests include advanced materials for interconnects, and packaging for electronics and optoelectronics applications, with an emphasis on both high-performance and low cost of ownership.
Liang is based in Shenzhen, China, and provides technical support for Indium Corporation’s electronics assembly materials, semiconductor, engineering solders, and thermal management materials for customers in southern China. Liang has more than ten years of experience in electronics assembly, including providing field support for soldering materials applications.
インジウム・コーポレーションは、世界のエレクトロニクス、半導体、薄膜、熱管理、太陽電池市場に材料を供給する一流メーカーです。製品には、はんだおよびフラックス、ろう材、熱界面材料、スパッタリングターゲット、インジウム、ガリウム、ゲルマニウム、スズの金属および無機化合物、NanoFoil®などがあります。1934年に設立されたインジウムは、グローバルな技術サポートと中国、マレーシア、シンガポール、韓国、英国、米国に工場を有しています。
インジウム・コーポレーションについての詳細は、www.indium.comをご覧いただくか、[email protected] まで電子メールでお問い合わせください。また、当社の専門家であるFrom One Engineer ToAnother®(#FOETA)を、www.facebook.com/indiumまたは@IndiumCorp でフォローすることもできます。
