Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, and Seven Liang, Assistant Area Technical Manager – Southern China, presented at two separate events in China on Sept. 18.
Dr. Lee delivered a presentation, Challenges and Solutions for the Assembly of Thin-Profile Devices, at a seminar hosted by Indium Corporation and ZESTRON in Chengdu. His presentation included a discussion regarding the challenges for materials, processes, reliability, and cost of thin-profile devices, as well as Indium Corporation’s development of a new flux and soldering alloy that address these critical challenges.
Liang presented Engineered Solders Instructions and Application Case Study at the IPC Tour event in Shenzhen. Topics covered included engineered solder attributes, performance, processes, and examples.
Dr. Lee is a world-renowned soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests include advanced materials for interconnects, and packaging for electronics and optoelectronics applications, with an emphasis on both high-performance and low cost of ownership.
Liang is based in Shenzhen, China, and provides technical support for Indium Corporation’s electronics assembly materials, semiconductor, engineering solders, and thermal management materials for customers in southern China. Liang has more than ten years of experience in electronics assembly, including providing field support for soldering materials applications.
Indium Corporation 是全球電子、半導體、薄膜、熱管理和太陽能市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、馬來西亞、新加坡、南韓、英國和美國。
如需更多關於 Indium Corporation 的資訊，請造訪www.indium.com或寄電子郵件至 [email protected]。您也可以透過www.facebook.com/indium或@IndiumCorp 追蹤我們的專家，From One Engineer ToAnother®(#FOETA)。
