Indium Corporation will feature selections from its portfolio of high-reliability solutions for power electronics at the International Conference on Integrated Power Electronics (CIPS), March 15-17 in Berlin, Germany.
Indium Corporation is the leader in power electronics assembly materials as a variety of industriesincluding automotive, transportation, computing, and energy infrastructuredemand more from power electronics systems. Indium Corporation continues to deliver proven high-reliability material solutions to current and emerging power electronics challenges.
Indium Corporations InFORMS solder preforms do more than just bond two surfacesthey are designed to address specific challenges for the power electronics industry. InFORMS are a composite solder material with a reinforcing matrix. This results in:
- Gleichmäßige Dicke der Bondlinie
- Verbesserte mechanische und thermische Zuverlässigkeit
- Drop-in alternative to traditional preforms leveraging proven processes
InFORMS provide engineers with an enhanced material for the development of more reliable and higher performance modules. Due to the planarity improvements and stand- off tolerances, the package design becomes more predictable. In addition, stronger and more dependable joints allow for high power densities.
For more information, visit Indium Corporations experts at the show.
Über Indium Corporation
Die Indium Corporation ist ein führender Materialveredler, -schmelzer, -hersteller und -lieferant für die weltweiten Elektronik-, Halbleiter-, Dünnschicht- und Wärmemanagementmärkte. Zu den Produkten gehören Lote und Flussmittel, Hartlote, Materialien für thermische Schnittstellen, Sputtertargets, Metalle und anorganische Verbindungen aus Indium, Gallium, Germanium und Zinn sowie NanoFoil. Das 1934 gegründete Unternehmen verfügt über einen weltweiten technischen Support und Fabriken in China, Deutschland, Indien, Malaysia, Singapur, Südkorea, dem Vereinigten Königreich und den Vereinigten Staaten.
Weitere Informationen über die Indium Corporation finden Sie unterindiumstg.wpenginepowered.comoder per E-Mail beiJingya Huang. Sie können auch unseren Experten von „From One Engineer To Another“ (, #FOETA) unterwww.linkedin.com/company/indium-corporation/oder@IndiumCorp folgen.
About CIPS
In the next decades, power electronic system development will be driven by energy saving systems, intelligent energy management, power quality, system miniaturization, and high-reliability. Monolithic and hybrid system integration will include advanced device concepts, (e.g. wide bandgap devices, new packaging technologies, and the overall integration of actuators/drivesmechatronic integration).
CIPS is consequently focused on the following main aspects:
- Assembly and interconnect technology for power electronic devices and converters
- Integration of hybrid systems and mechatronic systems with high power density
- Systems and components operational behavior and reliability
