Indium Corporation will feature selections from its portfolio of high-reliability solutions for power electronics at the International Conference on Integrated Power Electronics (CIPS), March 15-17 in Berlin, Germany.
Indium Corporation is the leader in power electronics assembly materials as a variety of industriesincluding automotive, transportation, computing, and energy infrastructuredemand more from power electronics systems. Indium Corporation continues to deliver proven high-reliability material solutions to current and emerging power electronics challenges.
Indium Corporations InFORMS solder preforms do more than just bond two surfacesthey are designed to address specific challenges for the power electronics industry. InFORMS are a composite solder material with a reinforcing matrix. This results in:
- Uniform bondline thickness
- Improved mechanical and thermal reliability
- Drop-in alternative to traditional preforms leveraging proven processes
InFORMS provide engineers with an enhanced material for the development of more reliable and higher performance modules. Due to the planarity improvements and stand- off tolerances, the package design becomes more predictable. In addition, stronger and more dependable joints allow for high power densities.
For more information, visit Indium Corporations experts at the show.
關於 Indium Corporation
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料精煉商、冶煉商、製造商和供應商。產品包括焊料和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil 。公司成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、德國、印度、馬來西亞、新加坡、南韓、英國和美國。
如需進一步了解 Indium Corporation 的相關資訊，請造訪indiumstg.wpenginepowered.com或寄送電子郵件至Jingya Huang。您也可以在www.linkedin.com/company/indium-corporation/或@IndiumCorp 追蹤我們的專家專欄「From One Engineer To Another」（#FOETA）。
About CIPS
In the next decades, power electronic system development will be driven by energy saving systems, intelligent energy management, power quality, system miniaturization, and high-reliability. Monolithic and hybrid system integration will include advanced device concepts, (e.g. wide bandgap devices, new packaging technologies, and the overall integration of actuators/drivesmechatronic integration).
CIPS is consequently focused on the following main aspects:
- Assembly and interconnect technology for power electronic devices and converters
- Integration of hybrid systems and mechatronic systems with high power density
- Systems and components operational behavior and reliability
