Indium Corporation will feature selections from its portfolio of high-reliability solutions for power electronics at the International Conference on Integrated Power Electronics (CIPS), March 15-17 in Berlin, Germany.
Indium Corporation is the leader in power electronics assembly materials as a variety of industriesincluding automotive, transportation, computing, and energy infrastructuredemand more from power electronics systems. Indium Corporation continues to deliver proven high-reliability material solutions to current and emerging power electronics challenges.
Indium Corporations InFORMS solder preforms do more than just bond two surfacesthey are designed to address specific challenges for the power electronics industry. InFORMS are a composite solder material with a reinforcing matrix. This results in:
- Uniform bondline thickness
- Improved mechanical and thermal reliability
- Drop-in alternative to traditional preforms leveraging proven processes
InFORMS provide engineers with an enhanced material for the development of more reliable and higher performance modules. Due to the planarity improvements and stand- off tolerances, the package design becomes more predictable. In addition, stronger and more dependable joints allow for high power densities.
For more information, visit Indium Corporations experts at the show.
关于铟泰铟泰公司
Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.
如需了解铟泰公司更多信息，请访问indiumstg.wpenginepowered.com或发送电子邮件至Jingya Huang。您还可以关注我们的专家团队“From One Engineer To Another”（#FOETA），访问www.linkedin.com/company/indium-corporation/或关注@IndiumCorp。
About CIPS
In the next decades, power electronic system development will be driven by energy saving systems, intelligent energy management, power quality, system miniaturization, and high-reliability. Monolithic and hybrid system integration will include advanced device concepts, (e.g. wide bandgap devices, new packaging technologies, and the overall integration of actuators/drivesmechatronic integration).
CIPS is consequently focused on the following main aspects:
- Assembly and interconnect technology for power electronic devices and converters
- Integration of hybrid systems and mechatronic systems with high power density
- Systems and components operational behavior and reliability
