Indium Corporation will feature its reinforced indium and solder alloy fabrications, InFORMS®, at IMAPS 49th International Symposium on Microelectronics (IMAPS 2016 – Packaging the Connected World), Oct. 10-13, in Pasadena, Calif.
InFORMS are reinforced solder preforms that maintain a constant bondline thickness, thus significantly improving thermal cycling reliability. This is a key requirement in many applications, including die-attach and baseplate-attach for IGBTs.
In one study where InFORMS were used to solder a DBC and baseplate of an IGBT, the following was achieved:
- 4-fach verbesserte Zuverlässigkeit bei Temperaturwechseln im Vergleich zu einem reinen Preform-Ansatz
- 2X verbesserte Zuverlässigkeit bei Temperaturwechseln im Vergleich zu einem Preform + Al-Drahtbond-Stitch-Ansatz
- Low-voiding of <1%
- Lower cost of ownership – an InFORM is a drop-in replacement for a standard preform or solder paste, requiring no additional process steps or equipment
InFORMS provide engineers with an enhanced material for the development of new, or the improvement of existing, applications. For more information about InFORMS, visit indiumstg.wpenginepowered.com/inform or visit Indium Corporation at booth #710.
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