Indium Corporation will feature its reinforced indium and solder alloy fabrications, InFORMS®, at IMAPS 49th International Symposium on Microelectronics (IMAPS 2016 – Packaging the Connected World), Oct. 10-13, in Pasadena, Calif.
InFORMS are reinforced solder preforms that maintain a constant bondline thickness, thus significantly improving thermal cycling reliability. This is a key requirement in many applications, including die-attach and baseplate-attach for IGBTs.
In one study where InFORMS were used to solder a DBC and baseplate of an IGBT, the following was achieved:
- 與純預成型方法相比，熱循環可靠性提高 4 倍
- 與預型件 + 鋁線銲接方式相比，熱循環可靠性提高 2 倍
- Low-voiding of <1%
- Lower cost of ownership – an InFORM is a drop-in replacement for a standard preform or solder paste, requiring no additional process steps or equipment
InFORMS provide engineers with an enhanced material for the development of new, or the improvement of existing, applications. For more information about InFORMS, visit indiumstg.wpenginepowered.com/inform or visit Indium Corporation at booth #710.
如需進一步了解 Indium Corporation，請造訪indiumstg.wpenginepowered.com或發送電子郵件至 [email protected]。您也可以在www.facebook.com/indium或@IndiumCorp 追蹤我們的專家團隊「From One Engineer ToAnother®」（#FOETA）。
