Indium Corporation will feature its reinforced indium and solder alloy fabrications, InFORMS®, at IMAPS 49th International Symposium on Microelectronics (IMAPS 2016 – Packaging the Connected World), Oct. 10-13, in Pasadena, Calif.
InFORMS are reinforced solder preforms that maintain a constant bondline thickness, thus significantly improving thermal cycling reliability. This is a key requirement in many applications, including die-attach and baseplate-attach for IGBTs.
In one study where InFORMS were used to solder a DBC and baseplate of an IGBT, the following was achieved:
- 4X improved thermal cycling reliability compared to a preform-only approach
- 2X improved thermal cycling reliability compared to a preform + Al wirebond stitch approach
- Low-voiding of <1%
- Lower cost of ownership – an InFORM is a drop-in replacement for a standard preform or solder paste, requiring no additional process steps or equipment
InFORMS provide engineers with an enhanced material for the development of new, or the improvement of existing, applications. For more information about InFORMS, visit indiumstg.wpenginepowered.com/inform or visit Indium Corporation at booth #710.
인듐 코퍼레이션(Indium Corporation)에 대한 자세한 정보는indiumstg.wpenginepowered.com을방문하거나[email protected]으로 이메일을 보내 주시기 바랍니다. 또한www.facebook.com/indium또는@IndiumCorp에서 당사의 전문가 그룹인 From One Engineer ToAnother®(#FOETA)를 팔로우하실 수 있습니다.
