Indium Corporation’s Chris Nash, Product Manager PCB Assembly Materials, is on SMT007’s list of the Top 10 Most-Read Articles for March for his show floor interview at IPC APEX Expo 2019.
During the interview, Nash shared how Indium Corporation delivers electrical, mechanical, and thermal reliability to customers’ processes and end products. While achieving reliability in any of these categories can improve product performance, it does come with its own unique challenges, such as dendritic growth, harsh environments caused by high-temperature power cycling, and voiding.
Nash also discussed how Indium Corporation’s no-clean, halogen-free Indium8.9HF Solder Paste is specially formulated to address these challenges.
Nash has worked for Indium Corporation for more than 10 years and has served in a number of roles, including inside sales, product management, and global technical support. He earned his bachelor’s degree from Clarkson University and holds his Six Sigma Green Belt from Dartmouth College’s Thayer School of Engineering. He is an SMTA-Certified Process Engineer and holds certifications from the IPC for both A-600 and A-610D standards.
Die Indium Corporation ist ein führender Materialhersteller und -lieferant für die weltweiten Märkte für Elektronik, Halbleiter, Dünnschichten und Wärmemanagement. Zu den Produkten gehören Lote und Flussmittel, Hartlote, Materialien für thermische Schnittstellen, Sputtertargets, Metalle und anorganische Verbindungen aus Indium, Gallium, Germanium und Zinn sowie NanoFoil®. Das 1934 gegründete Unternehmen verfügt über einen weltweiten technischen Support und Fabriken in China, Malaysia, Singapur, Südkorea, dem Vereinigten Königreich und den USA.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
